Cure kinetics of a nadic methyl anhydride cured tertiary epoxy mixture

Xu, Hongjie; Tian, Guofeng; Meng, Yan; Li, Xiaoyü; Wu, Dezhen

doi:10.1016/j.tca.2021.178942

Cited by 15 publications

(7 citation statements)

References 27 publications

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“…It can also be seen that the peak and valley values of both adhesives at different temperatures occur at a similar DOC. The isothermal curing processes of the two adhesives can be characterized by the autocatalytic reaction, and the isothermal curing kinetics of AD1 and AD2 can be described by the Kamal model 37,38 . Here, we modified the typical Kamal model to consider the effect of incomplete cure by adding the term α max :

\frac{d α}{d t} = (k_{1} + k_{2} α^{m}) {((), α_{\max} goodbreak- α)}^{n},

where the action rate constant k 1 was determined as the beginning reaction rate, and the other kinetic parameters m , n , and k 2 were determined using Kenny's analytical‐graphical method 39,40 .…”

Section: Resultsmentioning

confidence: 99%

Modeling the curing kinetics of two thermoset adhesives under varying temperature conditions

Zhang,

Liu,

Xia

et al. 2023

J of Applied Polymer Sci

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This paper presents detailed curing kinetics models for two thermoset adhesives. The cure kinetics were characterized using differential scanning calorimetry in both anisothermal and isothermal modes. The Sestak–Berggren autocatalytic model was applied to describe the anisothermal cure kinetics of the two adhesives with the Malek and undetermined coefficients methods determining their kinetic parameters. The Kamal autocatalytic model was adopted for the isothermal curing processes with the Kenny analytical‐graphical method determining the kinetic parameters. A modified Kamal model was developed by introducing a concept of the maximum degree of cure (DOC) and temperature‐depended kinetic parameters to describe the isothermal cure kinetics of the adhesive with a typical exothermic peak, and an extended Kamal model was further proposed by adding an initial‐phase‐control term to the modified Kamal model to describe the isothermal cure kinetics of the adhesive with two exothermic peaks. The results showed that the presented curing kinetics models with the determined parameters can precisely predict the evolutions of the DOC of the two thermoset adhesives in both anisothermal and isothermal modes.

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\frac{d α}{d t} = (k_{1} + k_{2} α^{m}) {((), α_{\max} goodbreak- α)}^{n},

Section: Resultsmentioning

confidence: 99%

Modeling the curing kinetics of two thermoset adhesives under varying temperature conditions

Zhang,

Liu,

Xia

et al. 2023

J of Applied Polymer Sci

View full text Add to dashboard Cite

show abstract

“…The glass transition temperature is not only a measure of the adhesive service temperature, but also an index of the matrix curing state [ 22 ]. The Di-Benedetto equation is used to describe the nonlinear relationship between T g and

.…”

Section: Resultsmentioning

confidence: 99%

Study on Curing Kinetics and the Mechanism of Ultrasonic Curing of an Epoxy Adhesive

et al. 2022

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Ultrasonic curing is an effective way to enhance the curing extent of composite material bonding in the aerospace industry. The non-thermal effect of ultrasonic has been revealed to improve curing efficiency. However, the mechanism of the ultrasonic non-thermal effect is still not clear. In this work, a variable activation energy model of ultrasonic curing was established by utilizing the iso-conversional method, including the activation energy of the thermal effect and activation energy of the non-thermal effect. The thermal effect caused by ultrasonic was accurately peeled off. An obvious decrease in activation energy was found from 54 kJ/mol in thermal curing to 38 kJ/mol in ultrasonic curing. The activation energy of the reaction system in ultrasonic curing was substituted into the modified Kamal autocatalytic equation, and the parameters of the ultrasonic curing kinetic model were estimated by means of an ALO algorithm. Further discussion based on in situ FTIR showed that the non-thermal effect of ultrasonic can affect the vibration strength, stability, and chemical bond energy of internal groups, but cannot cause the fracture of chemical bonds. Moreover, frontier molecular orbital analysis showed that the chemical reactivity of epoxy/amine molecules increased and the HOMO–LUMO energy gap decreased from 6.511 eV to 5.617 eV under the effect of ultrasonic.

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“…The Kamal model can be regarded as a superposition of n ‐order and autocatalytic models, which means the both reactions occur simultaneously. The more accurate description can be given in the following 16,21,39,40 :

\frac{italicdα}{italicdt} = (k_{1} + k_{2} α^{m}) {((), 1 goodbreak- α)}^{n}

where k 1 , k 2 are the rate constants, and m , n are reaction orders.…”

Section: Kinetic Methodsmentioning

confidence: 99%

“…The Kamal model can be regarded as a superposition of n-order and autocatalytic models, which means the both reactions occur simultaneously. The more accurate description can be given in the following 16,21,39,40 :…”

Section: Theoretical Basismentioning

confidence: 99%

Reliability evaluation of a new method developed for DSC curing kinetic model of epoxy resin

Jia

Zhu

Yan

et al. 2023

J of Applied Polymer Sci

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The curing kinetic model of epoxy resin is crucial for understanding reaction mechanism and accurately describing curing behavior of fiber reinforced polymer composites. In the investigations related to kinetic models of epoxy, much attention is payed to the curing characterizations of modified or mixed materials for the desired field of application in the case that the initial curing degree for calculating kinetic parameters is generally constant. In this paper, a new method by specifying the initial curing degree for kinetic parameters is developed to improve the accuracy of fitting models based on the resin systems and methods for activation energy. The curing kinetics of resin systems including Epoxy 4330, Epoxy 5212, and diglycidyl ether pentaerythritol vanillin diacetalbisphenol-A epoxy resin-4,4 0 -diaminodiphenyl sulfone (DEPVD-E51-DDS) are examined utilizing differential scanning calorimetric technique at five different heating rates. Additionally, Kissinger, Starink, and Friedman methods, and piecewise models are adopted to fit the experimental data. The predictions from fitting models using different initial curing degrees are subsequently compared with experimental data. It is concluded that the utilization of initial curing degree promotes the accuracy of fitting models.activation energy, curing kinetics, epoxy resin, fitting model | INTRODUCTIONEpoxy resin can be applied separately and also be taken as the matrix of fiber reinforced polymer (FRP) composites or particles reinforced epoxy hybrid composites 1 due to the superior properties such as easy processing, high chemical, and good adhesive properties, 2,3 which can be fabricated by various composite manufacturing

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Cure kinetics of a nadic methyl anhydride cured tertiary epoxy mixture

Cited by 15 publications

References 27 publications

Modeling the curing kinetics of two thermoset adhesives under varying temperature conditions

Modeling the curing kinetics of two thermoset adhesives under varying temperature conditions

Study on Curing Kinetics and the Mechanism of Ultrasonic Curing of an Epoxy Adhesive

Reliability evaluation of a new method developed for DSC curing kinetic model of epoxy resin

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