Cure Kinetics of Electrically Conductive Adhesives

Abstract

Electrically conductive adhesives (ECA) are an alternative interconnection method for crystalline silicon solar cells, providing low thermomechanical stress, being lead-free and applicable to new contact structures. The ability to control their curing reaction in a stringing or lamination process is essential for enabling cost effective and reliable industrial module production. We set up an autocatalyzed model for the curing reaction of ECAs. The model is parameterized using dynamic differential scanning calorimetry (DSC) measurements and isoconversional methods for parameter extraction. We use the model to simulate arbitrary temperature profiles and find a good agreement to experimental data with 5-10 % (abs.) error. Furthermore the model is used to calculate the advancing degree of cure of ECA during a typical lamination process.