Curing kinetics and mechanical properties of fast curing epoxy resins with isophorone diamine and <i>N</i>‐(3‐aminopropyl)‐imidazole

Zhao, Xueting; Huang, Zhenqiang; Song, Ping; Yang, Hao; Zhang, Yanfei

doi:10.1002/app.47950

Cited by 20 publications

(10 citation statements)

References 42 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Since the glass to rubbery transitions in same cases are very broad, the exact location of the peaks of the tan δ curves has been obtained using signal processing. As observed in Figure 4a and Table 2, the unexposed SC system presents E′ G values in the range of 2500 MPa, which are typical for epoxy systems [4,5,19,20,24,25]. Water exposure results in up to 16% deterioration of the E′ G while the E′ R is slightly improved, especially after immersion at water of 23°C (see Table 2).…”

Section: Results and Discussion 31 Water Exposurementioning

confidence: 71%

“…Typically in a two-component system, this occurs by allowing the resin to react with the hardener for several hours depending on the chemistry of the system and the applied temperature. In order to expedite processing, a new class of resin systems, namely fast curing ones, has been introduced by the chemical industry [3][4][5][6][7][8][9][10][11]. The target of the resin industry is to design fast curing systems that possess low viscosity, long pot life, and satisfactory performance.…”

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Fast curing versus conventional resins – degradation due to hygrothermal and UV exposure

Barkoula¹,

Karabela²,

Zafeiropoulos³

et al. 2020

Express Polym. Lett.

View full text Add to dashboard Cite

In the current paper, three resin systems are investigated, the first is a high temperature fast curing system, the second is a high-temperature system that requires several hours to cure and the third is a slow room temperature curing system. All systems are exposed to hygrothermal and combined moisture/temperature/UV protocols, and their durability is assessed using Fourier transform infrared (FTIR) spectroscopy, mechanical and thermomechanical characterization. The conventional slow curing system presents a wide distribution of polymer chains that leads in excess free volume/increased susceptibility to water. The medium curing system is more homogenous and shows lower absorption profiles. The fast curing system shows two network domains, one that is more crosslinked and contributes towards higher free volume/water absorption and the other that is partially cured and supports chain scission/leaching processes during exposure. Continuation of crosslinking prevails in conventional resins upon hygrothermal and combined UV exposure. At the same time antagonistic effects (i.e. continuation of the crosslinking process versus plasticization, chain scission, and leaching) are observed in medium curing and fast curing systems upon exposure.

show abstract

Section: Results and Discussion 31 Water Exposurementioning

confidence: 71%

Section: Introductionmentioning

confidence: 99%

Fast curing versus conventional resins – degradation due to hygrothermal and UV exposure

Barkoula¹,

Karabela²,

Zafeiropoulos³

et al. 2020

Express Polym. Lett.

View full text Add to dashboard Cite

show abstract

“…Δ H decreases with increasing the heating rate, which indicates that the higher heating rates result in lower curing degree 22 . It is a further explanation that the increase of heating rate shortens the curing time of EPRS at every certain temperature, which leads to the lower curing degree 23 …”

Section: Resultsmentioning

confidence: 98%

Imidazole derivative with an intramolecular hydrogen bond as thermal latent curing accelerator for epoxy/phenolic resins

Wei

Gou

Sun

et al. 2021

J of Applied Polymer Sci

View full text Add to dashboard Cite

One‐component epoxy systems with long shelf life during storage or transportation, while high curing reactivity during molding as well as satisfactory mechanical and thermal performances after curing, are extremely essential for industrial application. Herein, we used salicylaldehyde and o‐phenylenediamine to synthesize 2‐(2′‐hydroxyphenyl)‐1H‐benzimidazole (HPBI), an imidazole derivative with an intramolecular hydrogen bond between the phenolic hydroxyl group and the pyridine‐type nitrogen atom of imidazole ring, and further employed HPBI as a thermal latent curing accelerator for epoxy/phenolic resins. The intramolecular hydrogen bond endowed HPBI with inert activity toward resins at room temperature, making the one‐component resin system a long‐term storage stability (21 days of shelf life at 30°C). Once rising the temperature to a high degree, a rather high activity of HPBI to accelerate the curing process of epoxy/phenolic resins. It was attributed to the effective release of high activity of the pyridine‐type nitrogen by breaking the intramolecular hydrogen bond at high temperature. In addition, the resulted thermosets from HPBI also possessed the comparable Tg (>130°C, determined by DMA) and thermostability (Td‐5% > 380°C) with that from common curing accelerators. Therefore, HPBI was proved to be a promising thermal latent curing accelerator applied in electronic packaging field.

show abstract

“…It shows that the curing reaction mechanism of the curing system is hardly affected by the heating rate. 48…”

Section: Resultsmentioning

confidence: 99%

Curing behavior, thermal, and mechanical properties of N,N′-(4,4′-diphenylmethane)bismaleimide/2,2′-diallylbisphenol A/3-allyl-5,5-dimethylhydantoin resin system

Liu

Chen

et al. 2019

High Performance Polymers

View full text Add to dashboard Cite

The 3-allyl-5,5-dimethylhydantoin (ADMH) was synthesized and characterized by Fourier transform infrared spectroscopy, 1H-nuclear magnetic resonance (NMR), and 13C-NMR spectroscopy. Then, the ADMH was used to modify the N, N′-(4,4′-diphenylmethane)bismaleimide (BDM)/2,2′-diallylbisphenol A (DABPA) resin to obtain the BDM/DABPA/ADMH resin system (BDA). The curing behavior was investigated by non-isothermal differential scanning calorimetry and the activation energy ([Formula: see text]) was obtained by Kissinger and Ozawa models. The thermomechanical property was measured by dynamic mechanical analysis. Analysis of the data revealed the complexity of the curing reaction, which was firstly dominated by the Ene reaction of allyl and C=C double bond at low and medium temperatures and was further governed by the Diels–Alder reaction and the anionic imide oligomerization occurred at high temperatures. The results demonstrated that 1-BDA had the best thermal and mechanical properties exhibiting excellent modification effect of ADMH.

show abstract

Curing kinetics and mechanical properties of fast curing epoxy resins with isophorone diamine and N‐(3‐aminopropyl)‐imidazole

Cited by 20 publications

References 42 publications

Fast curing versus conventional resins – degradation due to hygrothermal and UV exposure

Fast curing versus conventional resins – degradation due to hygrothermal and UV exposure

Imidazole derivative with an intramolecular hydrogen bond as thermal latent curing accelerator for epoxy/phenolic resins

Curing behavior, thermal, and mechanical properties of N,N′-(4,4′-diphenylmethane)bismaleimide/2,2′-diallylbisphenol A/3-allyl-5,5-dimethylhydantoin resin system

Contact Info

Product

Resources

About