2000
DOI: 10.1557/proc-612-d5.12.1
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Curing Study of Hydrogen Silsesquioxane Under H2/N2 Ambient

Abstract: Thin film properties of hydrogen silsesquioxane (HSQ) cured at different temperature under N2 and H2/N2 ambients have been studied. In this study, it was found that compared to an N2 ambient, film curing in an H2/N2 ambient will impact HSQ properties when the temperature is 400°C – 500°C. H2/N2 ambient can be used to minimize the dielectric constant while increasing modulus of the films. The data indicates that H2 can minimize the oxidation of the HSQ films and maintain the dielectric properties.

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Cited by 4 publications
(3 citation statements)
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“…If we again use the model that assumes negligible tension, the relation f ∝ E ρ implies that the density of the glass fibres must increase slightly during the curing process. This increase has been observed in HSQ thin films [16].…”
Section: Discussionsupporting
confidence: 68%
“…If we again use the model that assumes negligible tension, the relation f ∝ E ρ implies that the density of the glass fibres must increase slightly during the curing process. This increase has been observed in HSQ thin films [16].…”
Section: Discussionsupporting
confidence: 68%
“…HSQ was chosen for its high resolution ͑15 nm͒ and sensitivity in negative tone electron beam lithography, [5][6][7] well characterized properties, 8 availability, 9 and its chemical structure ͑HSiO 3/2 ͒ which should allow nearly complete conversion to SiO 2 with a minimal amount of impurities. Variable energy electron beam lithography allows control of the electron penetration depth in HSQ and in similar polymers over three orders of magnitude, from less than 10 nm to a͒ Electronic mail: dtanenbaum@pomona.edu greater than 10 m with a single exposure tool with beam energies from 200 eV to 30 keV.…”
Section: Fabrication Processmentioning
confidence: 99%
“…Because the I D /I G ratio of the hydrogenated graphene in Figure 2a (2 mC/ cm 2 ) is roughly unity, the H defect number density can be estimated to be ∼5 × 10 14 /cm 2 . Given the average HSQ film thickness of 30 nm, density 39 of ∼1.3 g/cm 3 , and molecular weight of 424 as H 8 Si 8 O 12 , the maximum integrated H atom flux available is 4.4 × 10 16 /cm 2 (equivalent to ∼10 ML). This gives ∼0.03 for net sticking probability (S) of H atom on 1 L graphene at 300 K, assuming that ∼70% of Si-H bonds are dissociated (Figure 2c) and that half of the liberated H atoms reach graphene surface.…”
mentioning
confidence: 99%