Current density dependent shear performance and fracture behavior of micro-scale BGA structure Cu/Sn–3.0Ag–0.5Cu/Cu joints under coupled electromechanical loads

Reliability assessment of ball grid array joints under combined application of thermal and power cycling: solder geometry effect

“…However, the stress values gradually decrease toward the center of solder joint. This event, also reported in other studies (Le et al , 2019), indicates that the center of solder ball is the more reliable site of the joint zone, whereas the interfaces are susceptible to the defect initiation and propagation. On the other side, one can see that the alteration of solder shape may lead to the change in the distribution of stress at the body of joint zones.…”

Abnormal Shear Performance of Microscale Ball Grid Array Structure Cu/Sn–3.0Ag–0.5Cu/Cu Solder Joints with Increasing Current Density

“…As the simulation and measurement results of temperature in solder joints under current stressing are quite close (see Figure 5), the influence of Joule heating on the shear strength of solder joints can be estimated through the influence of the T Joule on shear strength. The T Joule in the BGA structure solder [26] joints can be expressed as:…”

“…Therefore, numerous investigations have been conducted on the creep [17][18][19], thermal fatigue [20][21][22], and tensile [23][24][25] behaviors of solder joints under current stressing, while the shear behavior of solder joints under current stressing has received less attention. A recent study reported that the shear strength of dual-interface ball grid array (BGA) Cu/SAC305/Cu solder joints decreases as the current density increases from 6.0 × 10 3 to 1.1 × 10 4 A/cm 2 , and the fracture location changes from the solder matrix to the interface between the solder matrix and IMC layer (the solder/IMC layer interface) [26]. Owing to the excessively high current density, severe Joule heat is generated in the solder joints, which causes the athermal effect of current stressing being easily concealed and ignored in the analysis.…”

Role of alternating current shape on microstructure and damage evolution of solder joints

“…In fact, the integration of electronic modules comes at the expense of accelerated damage evolution in their vulnerable electronic parts, especially solder joints [5][6][7]. Thermal cycling, vibrational frequencies, electric current effects and harsh environmental situations are factors influencing reliability of solder joints [8][9][10][11][12][13]. Among them, the electric current with different failure mechanisms plays a significant role on the solder degradation.…”