2015
DOI: 10.1109/jphotov.2015.2409561
|View full text |Cite
|
Sign up to set email alerts
|

Current Transport Through Lead–Borosilicate Interfacial Glass Layers at the Screen–Printed Silver-Silicon Front Contact

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1
1

Citation Types

0
2
0

Year Published

2016
2016
2022
2022

Publication Types

Select...
6

Relationship

1
5

Authors

Journals

citations
Cited by 13 publications
(2 citation statements)
references
References 69 publications
0
2
0
Order By: Relevance
“…A further possibility may be the onset of band bending at the interface between Si and the PbO glass layer of the screen-printed contact. 30 In summary, while the P density at the Si surface is not anymore the limiting factor for contacting with low contact resistivity, care must be taken in experiments and in mass production that the emitter is sufficiently deep beneath the contacts. We take this into account in the proposed design of a high-efficiency emitter in Section VI.…”
Section: Contact Formation and Psgsmentioning
confidence: 99%
“…A further possibility may be the onset of band bending at the interface between Si and the PbO glass layer of the screen-printed contact. 30 In summary, while the P density at the Si surface is not anymore the limiting factor for contacting with low contact resistivity, care must be taken in experiments and in mass production that the emitter is sufficiently deep beneath the contacts. We take this into account in the proposed design of a high-efficiency emitter in Section VI.…”
Section: Contact Formation and Psgsmentioning
confidence: 99%
“…This is in good agreement with recent simulations on the re-distribution of hydrogen at similar temperatures [11] which predicts that there will be a significant build-up of hydrogen at the metal contacts. The mechanism by which hydrogen might act to increase contact resistance is currently unknown, although possibilities include alteration of the glass between the screen printed silver and the silicon or through interaction with defects and silver crystallites underlying this glass layer [12][13][14][15]. This paper will further explore the phenomenon of increased contact resistance due to post-firing thermal processes.…”
Section: Introductionmentioning
confidence: 99%