Current Trends in Patterning with Copper

Rickerby, Jenny; Steinke, Joachim H. G.

doi:10.1021/cr0104476

Cited by 130 publications

(104 citation statements)

References 159 publications

(558 reference statements)

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“…Copper is an important metal in construction, chemical, electrical and electronic industries: its low bulk resistivity and excellent electromigration properties make it a suitable replacement for gold and aluminum in wafer metallization and wire bonding applications [1][2]. Due to the electrodissolution and corrosion of copper, there is a growing interest in the development of appropriate inhibitors for this metal.…”

Section: Introductionmentioning

confidence: 99%

Adsorption of cobalt (II) 5,10,15,20-tetrakis(2-aminophenyl)-porphyrin onto copper substrates: Characterization and impedance studies for corrosion inhibition

et al. 2012

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Section: Introductionmentioning

confidence: 99%

Adsorption of cobalt (II) 5,10,15,20-tetrakis(2-aminophenyl)-porphyrin onto copper substrates: Characterization and impedance studies for corrosion inhibition

et al. 2012

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“…The CVD of copper β-diketonates has previously been excellently reviewed, and so a summary of these precursors are presented in the following paragraph. 42,43 Copper(II) diacetylacetonate (Cu(acac) 2 ) evaporates between 180…”

Section: Betadiketonates and Betaketoiminatesmentioning

confidence: 99%

“…In this oxidation state, the copper precursor is supported by a coordinative ligand. There are many examples of this precursor family listed in the very thorough review by Rickerby and Steinke, 43 and these show a range of volatilization temperatures from 35…”

Section: Betadiketonates and Betaketoiminatesmentioning

confidence: 99%

Trends in Copper Precursor Development for CVD and ALD Applications

Gordon

Kurek

Barry

2014

ECS J. Solid State Sci. Technol.

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The continued dominance of copper in microelectronic manufacturing is due in part to the techniques that have kept pace with the relentless trend towards smaller feature sizes. Pure and defect-free copper features can be created at these and smaller scales using gas phase deposition methods such as chemical vapor deposition (CVD) and atomic layer deposition (ALD). Here we review the deposition processes and in particular surface chemistry for depositing copper metal by CVD and ALD. A summary of known processes is given, and new trends in copper film deposition research are discussed. As well, process parameters and properties of copper films deposited from precursors using key ligand systems such as aminoalkoxides, amidinates, guanidinates, betadiketonates and betaketoiminates are presented. Surface chemistry is examined from the point of view of the similarities of CVD and ALD, considering precursors that can be used in both types of processes. This serves to highlight trends in decomposition mechanisms and illuminates some interesting similarities in process temperature and other parameters.

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“…While thin films of copper can be deposited using a variety of 'dry' techniques such as PVD and CVD, 'wet' methods based on electrodeposition are generally preferred for most applications [5]. In microfabrication, the technique of through-mask plating [6] is typically employed to form patterned metal films on substrates.…”

Section: Introductionmentioning

confidence: 99%

Sono-electrodeposition transfer of micro-scale copper patterns on to A7 substrates using a mask-less method

Serrà¹,

Coleman

Gómez³

et al. 2016

Electrochimica Acta

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Current Trends in Patterning with Copper

Cited by 130 publications

References 159 publications

Adsorption of cobalt (II) 5,10,15,20-tetrakis(2-aminophenyl)-porphyrin onto copper substrates: Characterization and impedance studies for corrosion inhibition

Adsorption of cobalt (II) 5,10,15,20-tetrakis(2-aminophenyl)-porphyrin onto copper substrates: Characterization and impedance studies for corrosion inhibition

Trends in Copper Precursor Development for CVD and ALD Applications

Sono-electrodeposition transfer of micro-scale copper patterns on to A7 substrates using a mask-less method

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