Current understanding and applications of the cold sintering process

Abstract

In traditional ceramic processing techniques, high sintering temperature is necessary to achieve fully dense microstructures. But it can cause various problems including warpage, overfiring, element evaporation, and polymorphic transformation. To overcome these drawbacks, a novel processing technique called "cold sintering process (CSP)" has been explored by Randall et al. CSP enables densification of ceramics at ultra-low temperature (£300°C) with the assistance of transient aqueous solution and applied pressure. In CSP, the processing conditions including aqueous solution, pressure, temperature, and sintering duration play critical roles in the densification and properties of ceramics, which will be reviewed. The review will also include the applications of CSP in solid-state rechargeable batteries. Finally, the perspectives about CSP is proposed.

Engenharia de materiais: materializando o futuro

“…Há grande similaridade nos processos de prensagem a seco, porém a presença da solução atua melhorando a compactação pela atuação de três mecanismos: pressão adicional devido a capilaridade, ação lubrificante facilitando o rearranjo das partículas e dissolução preferencial das pontas, o que torna as partículas mais susceptíveis ao encaixe. Assim, a dissolução é mais intensa quanto maior for a pressão aplicada YU, 2019).…”

Cold sintering of microwave dielectric ceramics and devices

“…Despite recent advances, the sintering temperatures of LTCCs and ULTCCs are still much higher than can be withstood by a polymer-based printed circuit boards (PCBs < 200 °C), which inhibits the development of integrated, directly packaged RF devices and systems. CSCCs are a series of ceramics or ceramic composites that can be densified at ultralow temperatures < 200 °C by the cold sintering process (CSP) [3,[42][43][44][45][46][47][48][49], which enables not only co-firing with base-metal electrodes [3,50,51] but also PCBs [52] and polymers [43,53]. Along with CSCCs for RF applications, cold sintering has also been employed to densify ferroelectrics [54][55][56][57][58], piezoelectrics [59][60][61][62][63], thermoelectrics [64], semiconductors [65][66][67][68][69][70], electrolytes [71][72][73][74][75], cathodes [76,77] and oxides [78][79][80][81][82], which are widely used in many applic...…”

Insights Into the Microstructure and Dielectric Properties of Cold Sintered NaCa2Mg2V3O12 Based Composites

“…During the preliminary stage of cold sintering, particle rearrangement takes place through the liquid medium. The second stage is associated with the dissolution of particles with the presence of pressure and temperature, which leads to the development of a supersaturated phase, followed by nucleation and densification of the ceramic composites (Yu et al, 2019;Wang et al, 2021). Hence optimum time and temperature are necessary for proper densification of composites by cold sintering.…”