Curved infrared detectors: application to spectrometry and astronomy

Dumas, D. J.P.; Fendler, M.; Berger, François; Marion, F.; Arnaud, A.; Vialle, C.; Goudon, V.; Primot, Jérôme; Coarer, E. Le; Ribot, H.

doi:10.1117/12.856122

Cited by 6 publications

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“…By curving a Focal Plane Array (FP A), one can correct this aberration without extra corrective lenses [4]. This can be applied to terrestrial and spatial telescopes [5] and very compact high-performance cameras [6]. Also a step forward has been crossed toward bio-inspired cameras.…”

Section: Introductionmentioning

confidence: 98%

Mechanical behavior of flexible silicon devices curved in spherical configurations

Tekaya

Fendler

Inal

et al. 2013

2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and

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International audienceFoldable, stretchable and flexible electronics is of constant increasing interest since the early 2000's. Its applications spread from OLED-based displays, bio-inspired detectors and 'epidermal electronics'. Cylindrical curvature is largely studied through many 3 points and 4 points bending variations in electronic devices. However spherical curvature is poorly addressed, especially for monolithic approach. In this paper, a simulation and experiments of the elastic deformation of a thin silicon chip on a spherical holder are presented. The holder can have a concave or a convex shape. The chip is a square of 10 by 10 mm2. Its thickness is 50, 25 or 15 μm. The simulation is performed in 3 steps. First, the use of a shell model is validated by a convergence study and by a comparison with a 3D model and the literature. Then, the influence of the anisotropic elastic behavior (single crystal) is considered. In a given bulge test condition, isotropic and anisotropic silicon simulation gave similar deformations. At the end, the spherical forming is accomplished with a shell model and an anisotropic law. Experimental data is obtained by curving thin silicon plates of various thicknesses on different radii holders in a press. The comparison between experimental and computed results is realized. We found similar macroscopic deformations for both concave and convex shapes. The influence of chip thickness and applied pressure is studied on characteristic folds and flat part amplitudes. A heterogeneous stress distribution with hundreds of MPa variations can explain the difference observed between curved chips and perfect spherical holders. The stress level in electrical and optical active layers of thin curved silicon-based devices may affect their properties. A numerical example on a bolometer gives a stress-induced resistivity variation over 10

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Section: Introductionmentioning

confidence: 98%

Mechanical behavior of flexible silicon devices curved in spherical configurations

Tekaya

Fendler

Inal

et al. 2013

2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and

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“…Four uncooled detectors have been curved, the radius achieved is between 47mm and 53mm. No mechanical damage has been observed; folds are mainly out of the detecting matrix and so electrically the folds do not modify the resistance measured [6].…”

Section: Fig10 Uncooled Infrared Pixel and Overview Of The Sensor (Bolometer)mentioning

confidence: 85%

Curving monolithic infrared detectors: application to large field of view telescope and spectrometry

Dumas

Fendler

Berger

2019

International Conference on Space Optics — ICSO 2010

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“…Moreover, the readout circuit remains unchanged and always integrated into the focal plane, allowing the use of megapixel arrays with hundreds of thousands of pixels. The technology, which has been detailed by D.Dumas et al [13], takes advantage of the maturity of thin silicon substrates progress with grinding and polishing steps widely used in the production of micro-electronic 3D SiP devices (System-In-Package stacked devices). The silicon substrate of the CMOS readout circuit is thinned down to 50 µm.…”

Section: Hemispherical Infrared Focal Plane Arraysmentioning

confidence: 99%

Hemispherical infrared focal plane arrays: a new design parameter for the instruments

Fendler

Dumas

Chemla

et al. 2012

High Energy, Optical, and Infrared Detectors for Astronomy V

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In ground based astronomy, mainly all designs of sky survey telescopes are limited by the requirement that the detecting surface is flat whereas the focal surface is curved. Two kinds of solution have been investigated up to now. The first one consists in adding optical systems to flatten the image surface; however this solution complicates the design and increases the system size. Somehow, this solution increases, in the same time, the weight and price of the instrument. The second solution consists in curving artificially the focal surface by using a mosaic of several detectors, which are positioned in a spherical shape. However, this attempt is dedicated to low curvature and is limited by the technical difficulty to control the detectors alignment and tilt between each others.Today we would like to propose an ideal solution which is to curve the focal plane array in a spherical shape, thanks to our monolithic process developed at CEA-LETI based on thinned silicon substrates which allows a 100% optical fill factor. Two infrared uncooled cameras have been performed, using 320 x 256 pixels and 25 µm pitch micro-bolometer arrays curved at a bending radius of 80 mm. These two micro-cameras illustrate the optical system simplification and miniaturization involved by curved focal plane arrays. Moreover, the advantages of curved detectors on the optical performances (Point Spreading Function), as well as on volume and cost savings have been highlighted by the simulation of the opto-mechanical architecture of the spectrometer OptiMOS-EVE for the European Extremely Large Telescope (E-ELT).Keywords: infrared detectors / components design / curved retina / optical design / large field of view telescope / novel design / advanced detector / Si CMOS detectors / infrared focal plane arrays

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Curved infrared detectors: application to spectrometry and astronomy

Cited by 6 publications

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Mechanical behavior of flexible silicon devices curved in spherical configurations

Mechanical behavior of flexible silicon devices curved in spherical configurations

Curving monolithic infrared detectors: application to large field of view telescope and spectrometry

Hemispherical infrared focal plane arrays: a new design parameter for the instruments

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