Cutter for splitting brittle sheet blanks

Ogorodnikov, A. I.; Zhukov, Yu. N.; Tikhonov, E. E.; Savinykh, K. M.

doi:10.3103/s1068798x15060131

Cited by 5 publications

(2 citation statements)

References 3 publications

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“…When modeling the process of machining, a complex of phenomena in the deformation zone of the processed material and on the contact surfaces of the tool should be taken into account [6], for example, it becomes necessary to study the mechanism of local fracture through cracks propagation and formation of chips [7]. To simulate brittle fracture and calculate stresses in the material to be cut, the FE (Finite Element) solver method of CAE (Computer-Aided Engineering) programs can be used [8].…”

Section: Introductionmentioning

confidence: 99%

The Model of Local Fracture on Brittle Material Surface during Machining

Ogorodnikov

2022

KEM

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Brittle materials such as ceramics, glass or single-crystal silicon are extensively used for industrial applications and recently become an object of actual research due to the development of new products and technologies. In cases, where special attention is paid to the surface layer, mechanical processing with a diamond tool is of interest as one of the most efficient technology to manufacture products from brittle materials. In this paper, simulation method is presented, which allows to estimate an effect of cutting force on the size of defects zone formed in a hard brittle plate during machining. In the proposed model, there is a distinguished surface layer, which can have its own unique properties that differ from the properties of the brittle plate. In this work, the ANSYS finite element program is used to simulate the technological processes and solve the problem of stress distribution in a quasi-static formulation.

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Section: Introductionmentioning

confidence: 99%

The Model of Local Fracture on Brittle Material Surface during Machining

Ogorodnikov

2022

KEM

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“…Scratching is a general method for studying the behavior of brittle materials [1] and for dividing silicon wafers into separate dies in the whole electronics and semiconductor industry [2]. Micro-and nanoscratch experiments provide information on the mechanism of material removal, which is helpful for choosing machining parameters [3].…”

Section: Introductionmentioning

confidence: 99%