Abstract. The paper presents the results of computer simulation of silicon wafers under scribe loading conditions. Finite Element (FE) analysis was applied to estimate a value of stresses and spread of defect zone around scratch line. It was revealed that due to impact of diamond tip, a complex stress-strain state is produced in the wafer, which is related to the appearance of defect zones in silicon. The approved methods of cutting simulation could be employed for various types of brittle materials to predict defects and damage of crystal during separation processing.

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Brittle materials such as ceramics, glass or single-crystal silicon are extensively used for industrial applications and recently become an object of actual research due to the development of new products and technologies. In cases, where special attention is paid to the surface layer, mechanical processing with a diamond tool is of interest as one of the most efficient technology to manufacture products from brittle materials. In this paper, simulation method is presented, which allows to estimate an effect of cutting force on the size of defects zone formed in a hard brittle plate during machining. In the proposed model, there is a distinguished surface layer, which can have its own unique properties that differ from the properties of the brittle plate. In this work, the ANSYS finite element program is used to simulate the technological processes and solve the problem of stress distribution in a quasi-static formulation.

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