Simulation of defect zones in scribed silicon wafers

Abstract

Abstract. The paper presents the results of computer simulation of silicon wafers under scribe loading conditions. Finite Element (FE) analysis was applied to estimate a value of stresses and spread of defect zone around scratch line. It was revealed that due to impact of diamond tip, a complex stress-strain state is produced in the wafer, which is related to the appearance of defect zones in silicon. The approved methods of cutting simulation could be employed for various types of brittle materials to predict defects and damage of crystal during separation processing.

Data on the design optimization, indoor characterization and outdoor testing of GaAs/Bifacial Si heterojunction four-terminal photovoltaic systems

“… Cell scribing is a fundamental aspect of modern cell fabrication and has been the focus of an extensive research [2] . As the mini-module manufacturing process is a fundamental step of the realization of our device, we report the I-V characteristics of several mini-modules showing the variability introduced by the mechanical scribing; The distance between the solar cells and the dichroic mirrors has a considerable impact on the device performance, and the investigation on this aspect reported in this article illustrates an important step of the device optimization process which should be taken into account for the realization of similar devices; Most experimental studies of photovoltaic systems in outdoor conditions employ inverters in order to keep the system operating at its maximum power point [3] .…”

“…Cell scribing is a fundamental aspect of modern cell fabrication and has been the focus of an extensive research [2] . As the mini-module manufacturing process is a fundamental step of the realization of our device, we report the I-V characteristics of several mini-modules showing the variability introduced by the mechanical scribing;…”

The Model of Local Fracture on Brittle Material Surface during Machining

“…However, most brittle fracture theories have been developed in detail to ensure structural strength and prevent damage of the structure, so they are not completely meaningful for simulation of machining [3]. Currently, the behavior of brittle materials under the force loading has been intensively studied in connection with high-tech applications in the production of high-quality components of optical systems, semiconductor and micromechanical devices [4]. Directional destruction of brittle materials during machining has specific features.…”

Finite-element simulation of scratching on a coated brittle plate

“…Scratching is a general method for studying the behavior of brittle materials [1] and for dividing silicon wafers into separate dies in the whole electronics and semiconductor industry [2]. Micro-and nanoscratch experiments provide information on the mechanism of material removal, which is helpful for choosing machining parameters [3].…”