Cyclic mechanical behaviour of Sn3.0Ag0.5Cu alloy under high temperature isothermal ageing

Dompierre, B.; Aubin, Véronique; Charkaluk, Éric; Filho, W.C. Maia; Brizoux, M.

doi:10.1016/j.msea.2011.03.001

Cited by 13 publications

(4 citation statements)

References 28 publications

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“…It insures no ageing effect on the mechanical properties (cf. Dompierre et al (2011)). Table 1 summarises all the specimen produced, their quenching temperature and their dates of casting and testing.…”

Section: Specimen Manufacturingmentioning

confidence: 99%

Buckling of thick elasto-visco-plastic egg shells under external pressure: Experiments and bifurcation analysis

Jacquet

Tardif

Elguedj

et al. 2022

International Journal of Solids and Structures

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Section: Specimen Manufacturingmentioning

confidence: 99%

Buckling of thick elasto-visco-plastic egg shells under external pressure: Experiments and bifurcation analysis

Jacquet

Tardif

Elguedj

et al. 2022

International Journal of Solids and Structures

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“…Several Sn-based lead-free solder alloys have been proposed and studied to replace the Sn–Pb solders currently used in electronic packaging, as new global regulations such as the Restriction of Hazardous Substances directive have been enacted. , Among the proposed alloys, Sn–3.0Ag–0.5Cu (in wt %) solder, called SAC305, has good performance and has been investigated extensively. − To successfully form solder joints between a solder material and a substrate for electronic packaging, surface-finishing technologies for substrates such as printed circuit boards have developed, including bare Cu substrates, organic solderability preservation (OSP), hot-air solder leveling, immersion Sn, immersion Ag, electrolytic Ni/Au, electroless Ni/immersion Au (ENIG), and electroless Ni/electroless Pd/immersion Au (ENEPIG). Until recently, low-cost and simple Cu or Cu OSP were the most commonly used surface-finishing technologies for forming solder joints in electronic packaging.…”

Section: Introductionmentioning

confidence: 99%

Controlling Interfacial Reactions and Intermetallic Compound Growth at the Interface of a Lead-free Solder Joint with Layer-by-Layer Transferred Graphene

Lee

Yoon

et al. 2016

ACS Appl. Mater. Interfaces

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The immoderate growth of intermetallic compounds (IMCs) formed at the interface of a solder metal and the substrate during soldering can degrade the mechanical properties and reliability of a solder joint in electronic packaging. Therefore, it is critical to control IMC growth at the solder joints between the solder and the substrate. In this study, we investigated the control of interfacial reactions and IMC growth by the layer-by-layer transfer of graphene during the reflow process at the interface between Sn−3.0Ag−0.5Cu (in wt %) lead-free solder and Cu. As the number of graphene layers transferred onto the surface of the Cu substrate increased, the thickness of the total IMC (Cu 6 Sn 5 and Cu 3 Sn) layer decreased. After 10 repetitions of the reflow process for 50 s above 217 °C, the melting temperature of Sn−3.0Ag−0.5Cu, with a peak temperature of 250 °C, the increase in thickness of the total IMC layer at the interface with multiple layers of graphene was decreased by more than 20% compared to that at the interface of bare Cu without graphene. Furthermore, the average diameter of the Cu 6 Sn 5 scallops at the interface with multiple layers of graphene was smaller than that at the interface without graphene. Despite 10 repetitions of the reflow process, the growth of Cu 3 Sn at the interface with multiple layers of graphene was suppressed by more than 20% compared with that at the interface without graphene. The multiple layers of graphene at the interface between the solder metal and the Cu substrate hindered the diffusion of Cu atoms from the Cu substrate and suppressed the reactions between Cu and Sn in the solder. Thus, the multiple layers of graphene transferred at the interface between dissimilar metals can control the interfacial reaction and IMC growth occurring at the joining interface.

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“…Lead free solder is introduced to overcome this problem by replacing the lead with different materials such as silver and copper. Lead free solder such as SAC237, SAC305 and SAC405 are currently studied because of the low melting temperature which is nearer to SnPb, superior mechanical properties and good compatibility [2]- [4]. During soldering, the solder becomes supersaturated when some metals melt and dissolved into molten solder.…”

Section: Introductionmentioning

confidence: 99%

Interfacial Reaction Analysis of Sn-Ag-Cu Solder Reinforced with 0.01wt% CNTs with Isothermal Aging

Hanim

Aznan

Raimi

et al. 2016

MSF

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This study focused on the formation and growth of intermetallic compound (IMC) layer at the interfaces of pad finishes. The thickness of IMC layer, wetting angle, and defects such as floating IMC and voids formation after as reflow and isothermal aging were discussed. In this study, SAC237 (Sn: 99 wt.%, Ag: 0.3 wt.%, Cu: 0.7wt.%) reinforced with 0.01 wt.% of Multi-Walled Carbon Nanotubes (MWCNTs) were soldered on Electroless Nickel Immersion Gold (ENIG) and Immersion Tin (ImSn) pad finishes. Isothermal aging at 150°C for 400h, 800h, and 1200h were conducted after as reflow process. The IMC layer were analysed using optical microscope with image analyzer. The results shows the thickness of IMC layer for both ENIG and ImSn increased as the isothermal aging period increases. The increament was found from 1.49 μm to 1.73 μm for ENIG and 2.51 μm to 5.49 μm for ImSn. Floating IMC and voids formation were also observed on both pad finishes. Wetting angle for ENIG and ImSn varied from 16.21° to 36.85° and 24.27° to 34.41° respectively.

show abstract

Cyclic mechanical behaviour of Sn3.0Ag0.5Cu alloy under high temperature isothermal ageing

Cited by 13 publications

References 28 publications

Buckling of thick elasto-visco-plastic egg shells under external pressure: Experiments and bifurcation analysis

Buckling of thick elasto-visco-plastic egg shells under external pressure: Experiments and bifurcation analysis

Controlling Interfacial Reactions and Intermetallic Compound Growth at the Interface of a Lead-free Solder Joint with Layer-by-Layer Transferred Graphene

Interfacial Reaction Analysis of Sn-Ag-Cu Solder Reinforced with 0.01wt% CNTs with Isothermal Aging

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