Cylindrical Magnetron Sputtering

Thornton, J. A.; Penfold, A. S.

doi:10.1016/b978-0-12-728250-3.50007-6

Cited by 85 publications

(66 citation statements)

References 76 publications

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“…51 This idea was developed into a cylindrical hollow cathode device in which axial magnetic field is used to trap electrons, coined as magnetron sputtering. 1 The enhanced ionization with magnetic field lead to acceptable deposition rates as well as operation at pressures significantly lower than 4 Pa. 1 These coaxial cylindrical magnetron sputtering sources 52,53 were demonstrated in both hollow cathode 1,6 and center cathode configurations. 54,55 These were followed by the introduction of the planar magnetron sputtering device.…”

Section: A Planar Magnetron Sputtering Dischargementioning

confidence: 99%

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High power impulse magnetron sputtering discharge

Guðmundsson¹,

Brenning²,

Lundin³

et al. 2012

Journal of Vacuum Science &Amp; Technology A: Vacuum, Surfaces, and Films

637

446

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The high power impulse magnetron sputtering (HiPIMS) discharge is a recent addition to plasma based sputtering technology. In HiPIMS, high power is applied to the magnetron target in unipolar pulses at low duty cycle and low repetition frequency while keeping the average power about 2 orders of magnitude lower than the peak power. This results in a high plasma density, and high ionization fraction of the sputtered vapor, which allows better control of the film growth by controlling the energy and direction of the deposition species. This is a significant advantage over conventional dc magnetron sputtering where the sputtered vapor consists mainly of neutral species. The HiPIMS discharge is now an established ionized physical vapor deposition technique, which is easily scalable and has been successfully introduced into various industrial applications. The authors give an overview of the development of the HiPIMS discharge, and the underlying mechanisms that dictate the discharge properties. First, an introduction to the magnetron sputtering discharge and its various configurations and modifications is given. Then the development and properties of the high power pulsed power supply are discussed, followed by an overview of the measured plasma parameters in the HiPIMS discharge, the electron energy and density, the ion energy, ion flux and plasma composition, and a discussion on the deposition rate. Finally, some of the models that have been developed to gain understanding of the discharge processes are reviewed, including the phenomenological material pathway model, and the ionization region model.

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Section: A Planar Magnetron Sputtering Dischargementioning

confidence: 99%

“…49,52,72 But, not all the secondary electrons are confined in the target vicinity. To account for the electrons that are not trapped, Thornton and Penfold 52 assume an effective secondary electron emission coefficient,…”

Section: -63mentioning

confidence: 99%

High power impulse magnetron sputtering discharge

Guðmundsson¹,

Brenning²,

Lundin³

et al. 2012

Journal of Vacuum Science &Amp; Technology A: Vacuum, Surfaces, and Films

637

446

View full text Add to dashboard Cite

show abstract

“…We use a cylindrical magnetron sputtering technique [5] for application of the gold coating. Due to the small radius of the beampipes , DC-diode sputtering without magnetic field was not practicable, since high sputtering gas pressures would be required (ऎ300 mTorr) to sustain a discharge.…”

Section: Coating Methods and Apparatusmentioning

confidence: 99%

A method for gold coating experimental detector beampipes

Henderson

Roberts

1999

Proceedings of the 1999 Particle Accelerator Conference (Cat. No.99CH36366)

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A thin metallic coating is required on the inside of central detector beryllium beampipes at high-current e + e , colliders in order to suppress detector backgrounds that arise from scattered synchrotron radiation. As part of two CESR/CLEO upgrades, three beryllium beampipes have been coated with gold using a magnetron sputtering technique. The apparatus will be described as well as the factors that influence the adhesion and uniformity of the resulting films. Finally, we discuss the characterization methods of the resulting films.

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“…Thomton [ 46] defined magnetron sputtering as a system where the region around the cathode is filled with electrons; these electrons being constrained by an electric field and a magnetic field. As a result, many ions are made in the vicinity of the cathode.…”

Section: Chapter 2 Apparatus and Principles Of Ion Beam Deposition Tmentioning

confidence: 99%

Fabrication of TiNi shape memory alloy microactuators by ion beam sputter deposition

Tsuchiya

Davies

1998

Nanotechnology

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We report on the production of thin films of TiNi shape memory alloy, grown by ion beam sputter deposition (IBSD) using a Kaufman-type source, for microactuator applications. IBSD is a vacuum-coating process in which a target is bombarded by accelerated ions from a showered ion beam source and sputtered atoms of the target material are deposited onto a nearby substrate. In this work, argon ions at energies up to 1500 eV and current densities of are used to bombard sectored targets of titanium and nickel in order to deposit TiNi films onto unheated substrates. The films were characterized by electrical resistivity measurements and x-ray reflectometry. R-phase and martensitic transformations are seen without high-temperature annealing and the shape memory properties are compared with those of films prepared by DC and RF magnetron sputtering.

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Cylindrical Magnetron Sputtering

Cited by 85 publications

References 76 publications

High power impulse magnetron sputtering discharge

High power impulse magnetron sputtering discharge

A method for gold coating experimental detector beampipes

Fabrication of TiNi shape memory alloy microactuators by ion beam sputter deposition

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