2016
DOI: 10.1515/itit-2016-0028
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Dark silicon management: an integrated and coordinated cross-layer approach

Abstract: This paper presents an integrated and coordinated cross-layer sensing and optimization flow for distributed dark silicon management for tiled heterogeneous manycores under a critical temperature constraint. We target some of the key challenges in dark silicon for manycores, such as: directly focusing on power density/temperature instead of considering simple per-chip power constraints, considering tiled heterogeneous architectures with different types of cores and accelerators, handling the large volumes of ra… Show more

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Cited by 5 publications
(3 citation statements)
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“…However, information can still flow over physical channels such as heat dissipation, system load, cache-hit rates or network congestion, which can be queried by resource-aware programs and which endanger C. Such side channels can be further avoided through stronger spatial isolation, in which, for example, a set of unused processing elements or memory banks is left free between two applications on a tile. These buffer zones correspond to "physical borderlines" (or "dark resources") that further decrease the potential of side channels such as heat dissipation [22]. A sensitive application may even ask the run-time system to grant exclusive access to an entire tile.…”
Section: Constructive Measuresmentioning
confidence: 99%
“…However, information can still flow over physical channels such as heat dissipation, system load, cache-hit rates or network congestion, which can be queried by resource-aware programs and which endanger C. Such side channels can be further avoided through stronger spatial isolation, in which, for example, a set of unused processing elements or memory banks is left free between two applications on a tile. These buffer zones correspond to "physical borderlines" (or "dark resources") that further decrease the potential of side channels such as heat dissipation [22]. A sensitive application may even ask the run-time system to grant exclusive access to an entire tile.…”
Section: Constructive Measuresmentioning
confidence: 99%
“…Higher peak power also results in higher on-chip temperatures, which leads to reliability issues [2][3][4]. Higher temperatures can also trigger performance crippling thermal-throttling, which makes execution unpredictable [5]. We can minimize peak power by executing all of the tasks sequentially on a single core, but such an execution will violate the deadline.…”
Section: Introductionmentioning
confidence: 99%
“…First of all, power and temperature management have to perform dynamic voltage and frequency scaling or power gating of processing elements to stay within the thermal design power, as described in [16] (which is also part of this special issue). Furthermore, hardware faults might occur more often thus making resources temporally or, due to manufacturing variability and aging, even permanently unavailable (cf.…”
Section: Introductionmentioning
confidence: 99%