Debonding characterization of stiff film/compliant substrate systems based on the bilinear cohesive zone model

Long, Haitao; Liu, Yanwei; Wei, Yueguang

doi:10.1016/j.engfracmech.2022.108363

Cited by 11 publications

(1 citation statement)

References 44 publications

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“…In the literature, CZM has been implemented to simulate the many kinds of interfaces, including some applications related to polymers [ 8 ] and bonded joints [ 9 , 10 ]. Regarding power electronics applications, CZM has been used in copper-to-resin adhesion [ 11 ], solder joint interface delamination [ 12 ], the bonding/debonding behavior of bond pad structures [ 13 ], the debonding process of stiff film/compliant substrate systems [ 14 ], the failure mechanisms of stretchable electronics [ 15 ], the solder layer and semiconductor chip interface [ 16 ], and thermal fatigue [ 17 ], among others. Several approaches have been proposed in order to take into account the damage for fatigue loading, such as linking it to the maximum load the cycle [ 18 , 19 ] or the maximum principal strain [ 20 ] or including an unloading–reloading relation [ 21 , 22 ].…”

Section: Introductionmentioning

confidence: 99%

Finite Element Simulation and Sensitivity Analysis of the Cohesive Parameters for Delamination Modeling in Power Electronics Packages

Mirone,

Barbagallo,

Bua

et al. 2023

Materials

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Delamination is a critical failure mode in power electronics packages that can significantly impact their reliability and performance, due to the large amounts of electrical power managed by the most recent devices which induce remarkable thermomechanical loads. The finite element (FE) simulation of this phenomenon is very challenging for the identification of the appropriate modeling tools and their subsequent calibration. In this study, we present an advanced FE modeling approach for delamination, together with fundamental guidelines to calibrate it. Considering a reference power electronics package subjected to thermomechanical loads, FE simulations with a global–local approach are proposed, also including the implementation of a bi-linear cohesive zone model (CZM) to simulate the complex interfacial behavior between the different layers of the package. A parametric study and sensitivity analysis is presented, exploring the effects of individual CZM variables on the delamination behavior, identifying the most crucial ones and accurately describing their underlying functioning. Then, this work gives valuable insights and guidelines related to advanced and aware FE simulations of delamination in power electronics packages, useful for the design and optimization of these devices to mitigate their vulnerability to thermomechanical loads.

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