Decomposition and interfacial reaction in brazing of SiC by copper-based active alloys

Lee, Hyoung-Keun; Jai-Young, Lee

doi:10.1007/bf00728605

Cited by 36 publications

(5 citation statements)

References 2 publications

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“…Based on the EDS result and SAED pattern, Ni 2 Si‐type compound is defined to be (Ni, Fe, Co) 2 Si. Notably, Cu is identified adjacent to the SiC in Figure 6C, and similar phenomena have been observed by other researchers 23,24 Some scholars found that SiC could be decomposed by Cu, whereas Ag could suppress the decomposition 25,26 . However, the concrete effect of Cu in this study is indistinct, which needs further investigation.…”

Section: Resultssupporting

confidence: 78%

Brazing SiC ceramic to Al_0.3CoCrFeNi high‐entropy alloy using Ag–Cu filler metal

et al. 2022

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Realizing the joining of SiC ceramic to Al 0.3 CoCrFeNi high-entropy alloy is a technical interest for aviation, aerospace, and nuclear energy industry. In this study, the reliable brazing of SiC and Al 0.3 CoCrFeNi high-entropy alloy was realized by inactive AgCu filler, which lays the foundation for the following research on ceramic-high-entropy alloy dissimilar joining. The interfacial microstructure was characterized by a scanning electron microscope and transmission electron microscope in detail, and the influence of Al 0.3 CoCrFeNi dissolution on interfacial reactions was studied. The effect of brazing temperature on microstructure evolution and mechanical properties was discussed. The results indicated that elements Ni, Fe, Co, and Cr from Al 0.3 CoCrFeNi were crucial for the joint formation. (Ni, Fe, Co) 2 Si + graphite + Cr 23 C 6 /(Cr, Fe) 23 C 6 + (Ni, Fe, Co) 2 Si formed adjacent to SiC and (Fe, Co, Cr, Ni)-Si silicide + Cu(s,s) + Cu-Ni-Al-rich phase formed next to Al 0.3 CoCrFeNi. The reaction layers on SiC side thickened and the morphology of (Fe, Co, Cr, Ni)-Si-and Cu-Ni-Al-rich phase experienced distinct changes with the increasing temperature. The highest strength of ∼32.2 MPa was obtained at 850 • C for 10 min.

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Section: Resultssupporting

confidence: 78%

Brazing SiC ceramic to Al_0.3CoCrFeNi high‐entropy alloy using Ag–Cu filler metal

et al. 2022

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“…As they interact, the reaction product Si dissolves into the Cu matrix and the thermal conductivity of the SiC/ Cu composite decreases. [12][13][14][15][16] It is difficult for W coating to react with SiC and it can prevent the Cu diffusion. 17 In the meantime, W has good thermal conductivity (182 W m 21 K 21 ) and its existence has no detrimental influence on the thermal conduction.…”

Section: Discussionmentioning

confidence: 99%

SiC/Cu composites with tungsten coating prepared by powder metallurgy

Gan¹,

Chen²,

Wang³

et al. 2007

Materials Science and Technology

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A tungsten coating on SiC particles was produced using a sol-gel technique followed by reduction treatment in hydrogen for the first time. The microstructure and properties of Cu composites reinforced with as received and W coated SiC particles were studied. Experimental results showed that the W coating could effectively improve the wettability and increase the interfacial bonding between SiC and Cu. The fracture mechanism of SiC/Cu composites was found to change from interface debonding to matrix tearing owing to the introduction of W coating. The W coating also increased the thermal conductivity of SiC/Cu composites.

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“…Thus, a phase sequence SilN/fiNlTisSij (N)/Cu(s.s.Ti) will result. Upon brazing SiC (1100°C, 10-60 min, vacuum) using Cu-5 at% Ti alloy Lee and Lee [22] as well as Tarnai and Naka [18] observed an interfacial layered product scale of SiCf(ayer containing Cu, Si and ClTiCITisSi/(C)/Cu (s.s.Ti). Lee and Lee identified Cu 7 Si in the layer containing Cu, Si and C, while Tamai and Naka assumed Cu has diffused into SiC.…”

Section: Transient Liquid Phase Metal-ceramic Joiningmentioning

confidence: 99%

Phase Formation at Metal-Ceramic Interfaces

Schuster

1998

Interfacial Science in Ceramic Joining

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Phase diagram and diffusion path data are used to explore scenarios for phase formation at metal-ceramic interfaces in the quaternary systems AlN-Cu(fi), Si,N 4 -Cu(fi), and SiC-Cu(fi). For the cases where the metallic member is a Cu(fi) alloy, the diffusion path determines the sequence of phases formed. For the cases where the metallic component consists of a layer of Cu and a layer of Ti, conditions exist to form additional phases.

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Decomposition and interfacial reaction in brazing of SiC by copper-based active alloys

Cited by 36 publications

References 2 publications

Brazing SiC ceramic to Al_0.3CoCrFeNi high‐entropy alloy using Ag–Cu filler metal

Brazing SiC ceramic to Al_0.3CoCrFeNi high‐entropy alloy using Ag–Cu filler metal

SiC/Cu composites with tungsten coating prepared by powder metallurgy

Phase Formation at Metal-Ceramic Interfaces

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Decomposition and interfacial reaction in brazing of SiC by copper-based active alloys

Cited by 36 publications

References 2 publications

Brazing SiC ceramic to Al0.3CoCrFeNi high‐entropy alloy using Ag–Cu filler metal

Brazing SiC ceramic to Al0.3CoCrFeNi high‐entropy alloy using Ag–Cu filler metal

SiC/Cu composites with tungsten coating prepared by powder metallurgy

Phase Formation at Metal-Ceramic Interfaces

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Brazing SiC ceramic to Al_0.3CoCrFeNi high‐entropy alloy using Ag–Cu filler metal

Brazing SiC ceramic to Al_0.3CoCrFeNi high‐entropy alloy using Ag–Cu filler metal