A diamond MOSFET has been fabricated and characterized up to 250°C. The fabrication process has been improved in order to significantly reduce the specific on resistance, down to 50 mΩ.cm², and the gate leakage current at high temperature. The maximum electrical field in diamond, at the breakdown value of 175V, is estimated to be higher than 5.4 MV/cm, with a boron doping of 2×10 17 cm-3 .