In the Printed Circuit Boards (PCBs) manufacturing, the defect detection is an important task that helps in improving the quality of PCBs production. The conventional defect detection schemes include few drawbacks like high computational cost, noise susceptibility, and strongly depends on a carefully designed template. To highlight the above stated drawbacks, a new hybrid deep learning model is proposed in this manuscript. Initially, the input PCB defective images are collected from the PCB defect dataset and further, the feature extraction is performed by utilizing Binary Robust Invariant Scalable Keypoints (BRISK) and Speeded up Robust Features (SURF) for extracting the feature vectors from the PCB defective image. The extracted feature vectors are multi-dimensional that increase the computational complexity, so the stacked autoencoder technique is applied for reducing dimension of the extracted feature vectors. The stacked autoencoder technique effectively selects minimal sub-set of non-redundant and relevant feature vectors and it is used for representing the datasets from original feature space to a reduced and more informative feature space. Finally, the selected feature vectors are fed to the Bi-Long Short Memory Network (Bi-LSTM) for classifying the defect types like mouse bite, spurious copper, short, spur, missing hole, and open circuit. The extensive experimental outcome confirmed that the hybrid deep learning model obtained higher performance in the PCB defect detection with the classification accuracy of 99.99%, which is superior related to the comparative models.