2022
DOI: 10.1038/s41467-022-34288-4
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Defect free strain relaxation of microcrystals on mesoporous patterned silicon

Abstract: A perfectly compliant substrate would allow the monolithic integration of high-quality semiconductor materials such as Ge and III-V on Silicon (Si) substrate, enabling novel functionalities on the well-established low-cost Si technology platform. Here, we demonstrate a compliant Si substrate allowing defect-free epitaxial growth of lattice mismatched materials. The method is based on the deep patterning of the Si substrate to form micrometer-scale pillars and subsequent electrochemical porosification. The inve… Show more

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Cited by 16 publications
(8 citation statements)
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“…This enables the distinction between the critical angle of PGe layer (θ PGe ) and of the bulk Ge (θ Ge ) as shown in Figure 4b. The porosity can therefore be calculated using Equation (1). Variation of PGe critical angle with porosity is shown in Figure S2, Supporting Information.…”
Section: Resultsmentioning
confidence: 99%
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“…This enables the distinction between the critical angle of PGe layer (θ PGe ) and of the bulk Ge (θ Ge ) as shown in Figure 4b. The porosity can therefore be calculated using Equation (1). Variation of PGe critical angle with porosity is shown in Figure S2, Supporting Information.…”
Section: Resultsmentioning
confidence: 99%
“…The XRR was used to measure the critical angle of PGe layer. The porosity (P) was then calculated using Equation (1) where θ PGe and θ Ge correspond to the critical angle of the PGe layer and of the bulk Ge, respectively. [52,53] (1 ) 100…”
Section: Methodsmentioning
confidence: 99%
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“…[30][31][32] Typically, the epitaxial interface between Si and Ge can induce ≈4.18% interfacial strain. [33][34][35] When the epitaxial single-crystalline Si nanomembrane on Ge or Si 1−x Ge x sacrificial layer is released, residual stress at the epitaxial interface can spontaneously drive the formation of 3D structures, including tubular and wrinkled structures, [7,36,37] which is a solid foundation for the preparation of 3D Si nanomembranes electronic and optoelectronic devices.…”
Section: Introductionmentioning
confidence: 99%