Cu2O/CuO
bilayers were fabricated by electrodeposition
of the CuO layer in a copper(II)–ammonia complex aqueous solution,
followed by photoelectrochemical deposition of the Cu2O
layer at potentials ranging from −0.3 to −1.0 V referenced
to a Ag/AgCl electrode in a copper(II)–lactate complex aqueous
solution under light irradiation, and the effects of varied potentials
of the photoelectrochemical Cu2O depositions and post-heating
conditions on their structural, optical, and photovoltaic characteristics
were investigated with X-ray diffraction, field emission-scanning
electron microscopy, optical absorption measurements, and external
quantum efficiency (EQE) measurements with and without applied bias
voltage. The Cu2O layers with a characteristic 2.1 eV band
gap energy were adhesively stacked on the thorn-like grains of the
CuO layers possessing a characteristic 1.5 eV band gap energy, and
dense and defect-free Cu2O/CuO bilayers could be fabricated
at the potentials of −0.4 and −0.5 V, but the grain
size of Cu2O decreased at −0.5 V. In addition, the
metallic Cu was deposited simultaneously at potentials less than −0.7
V. The Cu2O/CuO bilayer fabricated at −0.4 V revealed
photovoltaic features at wavelengths ranging from 350 nm to approximately
900 nm, and a maximum EQE value of 56.8% was achieved at 510 nm in
wavelength with a bias voltage of −0.1 V. The maximum EQE value,
however, decreased to 1.2% accompanied with the peak wavelength shift
to 580 nm, and no photovoltaic feature was observed at potentials
of −0.3, −0.7, and −1.0 V. The photovoltaic performance
for the Cu2O/CuO bilayer fabricated at −0.4 V was
ameliorated by heating at 423 K, and the maximum EQE values were enhanced
to 87.7% at 550 nm and 89.8% at 530 nm in an ambient atmosphere and
vacuum. Both the Cu2O and CuO layers acted as photovoltaic
layers in the Cu2O/CuO bilayer fabricated at −0.4
V and heated at 423 K, and the electrical characteristic including
the carrier mobility affected the photovoltaic performance. The photovoltaic
feature, however, disappeared by heating above 523 K due to the formation
of nanopores inside the CuO layer and near the CuO heterointerface
to the Cu2O and fluorine-doped tin oxide substrate.