2014
DOI: 10.1016/j.msea.2013.11.032
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Deformation behavior and microstructure evolution of pure Cu subjected to electromagnetic bulging

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Cited by 14 publications
(3 citation statements)
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“…The engineering stress and strain can be obtained by tensile tests at room temperature. The true stress and strain can be calculated by Equations (4) and (5). Thus, the true stress-strain curve of pure aluminum under quasi-static conditions can be seen in Figure 3.…”
Section: Experimental and Finite Element Simulationmentioning
confidence: 99%
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“…The engineering stress and strain can be obtained by tensile tests at room temperature. The true stress and strain can be calculated by Equations (4) and (5). Thus, the true stress-strain curve of pure aluminum under quasi-static conditions can be seen in Figure 3.…”
Section: Experimental and Finite Element Simulationmentioning
confidence: 99%
“…A detailed review by Psyk et al [1] showed that EMF has several advantages compared with conventional quasi-static forming, such as increased forming limits. Many scholars have proven that the formability of various materials can be dramatically increased under EMF, such as aluminum [2], steel [3], magnesium [4], copper [5], and titanium [6].…”
Section: Introductionmentioning
confidence: 99%
“…5) Jiang et al reported the dislocation slip mechanism of electromagnetic bulged pure Cu based on microstructure observation. 6,7) Ferreira et al deformed a 304 stainless steel using electromagnetic forming (EMF) and found that the plastic deformation in this case was dominated by twinning due to the easy nucleation of partial dislocations at high strain rate. 8) It is hard to understand the deformation mechanism only by microstructure observation of the deformed metal.…”
Section: Introductionmentioning
confidence: 99%