Deformation behavior of a 2219 Al alloy

Kaibyshev, Rustam; Sitdikov, Oleg; Mazurina, I.; Lesuer, D.R.

doi:10.1016/s0921-5093(01)01777-4

Cited by 94 publications

(40 citation statements)

References 21 publications

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“…At 300 • C the stress exponent is about 17. With increasing temperature from 400 to 450 • C the stress exponent diminishes to approximately 7 and 5, respectively [30]. At the highest temperature of 520 • C a transition from low strain rate behaviour with stress exponents varying between 2 and 3, to high strain rate behaviour with a stress exponent of about 4.5 is observed.…”

Section: Deformation Mechanismsmentioning

confidence: 87%

Microstructure and creep behaviour of an Osprey processed and extruded Al–Cu–Mg–Ti–Ag alloy

Eddahbi

Jiménez

Ruano

2007

Journal of Alloys and Compounds

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This paper reports the microstructure and creep behaviour of an Al-Cu-Mg-Ti-Ag alloy processed via Osprey forming and extrusion. The microstructure of the as-received extruded bars showed elongated grains towards the extrusion direction, which contained a fine substructure. Elongation to failure values of about 25% were obtained at test temperatures up to 400 • C and for strain rates ranging from 10 −4 to 10 −2 s −1 . In this temperature range, the mechanical behaviour of the alloy was similar to that of particle-strengthened aluminium alloys: (1) the apparent stress exponents of n = 17 and 7 were higher than that reported for most aluminium alloys; (2) the microstructure and the texture did not change significantly during tensile deformation. At temperatures higher than 400 • C, the elongated grains of the microstructure started to recrystallize into smaller grains and a maximum elongation to failure of 170% was observed at 520 • C and 10 −4 s −1 . Tensile tests performed at higher strain rates in this temperature range revealed a stress exponent of 4.5, which corresponds to a slip creep mechanism.

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Section: Deformation Mechanismsmentioning

confidence: 87%

Microstructure and creep behaviour of an Osprey processed and extruded Al–Cu–Mg–Ti–Ag alloy

Eddahbi

Jiménez

Ruano

2007

Journal of Alloys and Compounds

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“…At temperatures of 200°C and above, the dispersoids do not constitute insurmountable obstacles to mobile dislocations because they can easily overcome the dispersoids by climb in this temperature range. [44] B.…”

Section: A the Effect Of Temperature On Homogeneity Of Plastic Deformentioning

confidence: 99%

Plastic Flow Properties and Microstructural Evolution in an Ultrafine-Grained Al-Mg-Si Alloy at Elevated Temperatures

Kashyap

Hodgson

Estrin

et al. 2009

Metall Mater Trans A

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An AA6082 alloy was subjected to eight passes of equal channel angular pressing at 100°C, resulting in an ultrafine grain size of 0.2 to 0.4 lm. The tensile deformation behavior of the material was studied over the temperature range of 100°C to 350°C and strain rate range of 10 À4 to 10 À1 s À1 . The evolution of microstructure under tensile deformation was investigated by analyzing both the deformation relief on the specimen surface and the dislocation structure. While extensive microshear banding was found at the lower temperatures of 100°C to 150°C, deformation at higher temperatures was characterized by cooperative grain boundary sliding and the development of a bimodal microstructure. Dislocation glide was identified as the main deformation mechanism within coarse grains, whereas no dislocation activity was apparent in the ultrafine grains.

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“…Substitution of Eqs. (2) and (3) [19][20]. Over a wide range of stresses, the hyperbolic sine law is found to be most suitable form for explaining the deformation behavior.…”

Section: Constitutive Equationsmentioning

confidence: 95%

Hot-compression behaviors of W-50%Cu composite

et al. 2011

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The hot compression behaviors of W-50%Cu composite were investigated at the strain rate range from 0.01 to 5.00 s -1 and the temperature range from 850 to 1000 ºC on Gleeble-1500D hot simulator. The results show that the flow stress during hot compression of W-50%Cu composite is strongly affected by the compression temperature and the strain rate. Moreover, the flow stress decreases with the raising deforming temperature, and increases with the increasing strain rate. The flow stress of the W-50%Cu composite at high temperature can be expressed by Arrhenius model, and the values of structural factor A, stress scale parameter α, stress index n and hot deformation activation Q are 3.18 × 10 9 s -1 , 0.0133 MPa -1 , 6.27393 and 239.442 kJ/mol, respectively.

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Deformation behavior of a 2219 Al alloy

Cited by 94 publications

References 21 publications

Microstructure and creep behaviour of an Osprey processed and extruded Al–Cu–Mg–Ti–Ag alloy

Microstructure and creep behaviour of an Osprey processed and extruded Al–Cu–Mg–Ti–Ag alloy

Plastic Flow Properties and Microstructural Evolution in an Ultrafine-Grained Al-Mg-Si Alloy at Elevated Temperatures

Hot-compression behaviors of W-50%Cu composite

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