Deformation behavior of dilute SnBi(0.5 to 6 at. pct) solid solutions

Reinikainen, T.; Kivilahti, J.K.

doi:10.1007/s11661-999-0200-z

Cited by 66 publications

(34 citation statements)

References 17 publications

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“…A superficial study of this plot suggests that the Dorn equation is quite Adeva et al, 14) Mathew et al 15) and others 16,17) have measured much lower activation energies at lower temperature. The measured activation energies are close to those for lattice diffusion (∼100 kJ/mol 18,19) ) and dislocation pipe diffusion (40-60 kJ/mol 14,20,21) ) suggesting that the dominant activation step changes from lattice to pipe diffusion as the temperature drops.…”

Section: Creep Behaviorsupporting

confidence: 52%

Anomalous Creep in Sn-Rich Solder Joints

2002

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This paper discusses the creep behavior of example Sn-rich solders that have become candidates for use in Pb-free solder joints. The specific solders discussed are Sn-3.5Ag, Sn-3Ag-0.5Cu, Sn-0.7Cu and Sn-10In-3.1Ag, used in thin joints between Cu and Ni/Au metallized pads. The creep behavior of these joints was measured over the range 60-130 • C. The four solders show the same general behavior. At all temperatures their steady-state creep rates are separated into two regimes with different stress exponents (n). The low-stress exponents range from ∼3-6, while the high-stress exponents are anomalously high (7-12). Strikingly, the high-stress exponent has a strong temperature dependence near room temperature, increasing significantly as the temperature drops from 95 to 60 • C. The anomalous behavior of the solders appears to be due to the dominant Sn constituent. Joints of pure Sn have stress exponents, n, that change with stress and temperature almost exactly like those of the Sn-rich solder joints. Surprisingly, however, very similar behavior is found in Sn-10In-3.1Ag, whose primary constituent is γ -InSn. Research on creep in bulk samples of pure Sn suggests that the anomalous temperature dependence of the stress exponent is due to a change in the dominant mechanism of creep. Whatever its source, it has the consequence that conventional constitutive relations for steady-state creep must be used with caution in treating Sn-rich solder joints, and qualification tests that are intended to verify performance should be carefully designed.

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Section: Creep Behaviorsupporting

confidence: 52%

Anomalous Creep in Sn-Rich Solder Joints

2002

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“…26 The theory of dislocation viscous glide, however, leads to a stress exponent of 3 at high temperatures and 5 at low temperatures, the respective activation energies being equal to solute interdiffusion and to dislocation pipe diffusion. 27 The activation energy of 54.2 kJ mol -1 , obtained for samples under the unhomogenized condition in the low-stress regime, is close to the activation energy of about 61.2 kJ mol -1 reported for the dislocation pipe diffusion (Qp) of Sn. 26 This can be estimated by Q p = 0.6 Q D , where Q D = 102 kJ mol -1 is the activation energy of lattice selfdiffusion of b-Sn.…”

Section: Resultssupporting

confidence: 78%

Effect of Homogenization on the Indentation Creep of Cast Lead-Free Sn-5%Sb Solder Alloy

Mahmudi

Geranmayeh

Allami

et al. 2007

Journal of Elec Materi

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Creep behavior of cast lead-free Sn-5%Sb solder in unhomogenized and homogenized conditions was investigated by long time Vickers indentation testing under a constant load of 15 N and at temperatures in the range 321-405 K. Based on the steady-state power law creep relationship, the stress exponents were found for both conditions of the material. The creep behavior in the unhomogenized condition can be divided into two stress regimes, with a change from the low-stress regime to the high-stress regime occurring around 11.7 · 10 -4 < (H V /E) < 18 · 10 -4 . The low stress regime activation energy of 54.2 kJ mol -1 , which is close to 61.2 kJ mol -1 for dislocation pipe diffusion in the Sn, and stress exponents in the range 5.0-3.5 suggest that the operative creep mechanism is dislocation viscous glide. This behavior is in contrast to the high stress regime in which the average values of n = 11.5 and Q = 112.1 kJ mol -1 imply that dislocation creep is the dominant deformation mechanism. Homogenization of the cast material resulted in a rather coarse recrystallized microstructure with stress exponents in the range 12.5-5.7 and activation energy of 64.0 kJ mol -1 over the whole ranges of temperature and stress studied, which are indicative of a dislocation creep mechanism.

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“…It has been suggested that dislocation viscous glide is characterized by a stress exponent of 3 at high temperatures and 5 at low temperatures, with the respective activation energies being equal to those for solute interdiffusion and dislocation pipe diffusion. 31 Climb of edge dislocations becomes the rate-controlling mechanism in pure metals at high temperatures, with n-values in the range of 4 to 6 and activation energy that is equal to the activation energy for lattice self-diffusion through the lattice. At lower temperatures, dislocation pipe diffusion becomes dominant, in which case the n-value increases to 7 and the activation energy reaches that of the activation energy for pipe diffusion.…”

Section: Resultsmentioning

confidence: 99%

Impression Creep of a Lead-Free Sn-1.7Sb-1.5Ag Solder Reinforced by Submicron-Size Al2O3 Particles

Kangooie

Mahmudi

Geranmayeh

2009

Journal of Elec Materi

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In the present study, the Sn-1.7Sb-1.5Ag solder alloy and the same material reinforced with 5 vol.% of 0.3-lm Al 2 O 3 particles were synthesized using the powder metallurgy route of blending, compaction, sintering, and extrusion. The impression creep behavior of both monolithic and composite solders was studied under a constant punching stress in the range of 20 MPa to 110 MPa, at temperatures in the range of 320 K to 430 K. The creep resistance of the composite solder was higher than that of the monolithic alloy at all applied stresses and temperatures, as indicated by their corresponding minimum creep rates. This was attributed to the dispersive distribution of the submicron-sized Al 2 O 3 particles in the composite solder. Assuming a power-law relationship between the impression stress and velocity, average stress exponents of 5.3 to 5.6 and 5.8 to 5.9 were obtained for the monolithic and composite materials, respectively. Analysis of the data showed that, for all loads and temperatures, the activation energy for both materials was almost stress independent, with average values of 44.0 kJ mol À1 and 41.6 kJ mol À1 for the monolithic and composite solders, respectively. These activation energies are close to the value of 46 kJ mol À1 for dislocation climb, assisted by vacancy diffusion through dislocation cores in the Sn. This, together with the stress exponents of about 5 to 5.9, suggests that the operative creep mechanism is dislocation viscous glide controlled by dislocation pipe diffusion.

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Deformation behavior of dilute SnBi(0.5 to 6 at. pct) solid solutions

Cited by 66 publications

References 17 publications

Anomalous Creep in Sn-Rich Solder Joints

Anomalous Creep in Sn-Rich Solder Joints

Effect of Homogenization on the Indentation Creep of Cast Lead-Free Sn-5%Sb Solder Alloy

Impression Creep of a Lead-Free Sn-1.7Sb-1.5Ag Solder Reinforced by Submicron-Size Al2O3 Particles

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