Deformation behaviour of DLC coatings on (111) silicon substrates

Haq, Ayesha J; Munroe, Paul; Hoffman, Mark; Martin, Phil; Bendavid, Avi

doi:10.1016/j.tsf.2007.06.032

Cited by 20 publications

(22 citation statements)

References 20 publications

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“…1b), which is a discontinuous decrease in the indentation displacement, usually during unloading. Popouts may also be ascribed to dislocation motion (Cross et al, 2006) and phase transformations (Juliano et al, 2004;Ruffell et al, 2007;Haq et al, 2007;Lee & Fong, 2008). A lower unloading rate or a higher maximum indentation load promotes the occurrence of a pop-out (Chang & Zhang, 2009).…”

Section: Nanoindentation Of Crystalline Materialsmentioning

confidence: 99%

Effect of the Spherical Indenter Tip Assumption on the Initial Plastic Yield Stress

Ma¹,

Levine²,

Dixson³

et al. 2012

Nanoindentation in Materials Science

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Section: Nanoindentation Of Crystalline Materialsmentioning

confidence: 99%

Effect of the Spherical Indenter Tip Assumption on the Initial Plastic Yield Stress

Ma¹,

Levine²,

Dixson³

et al. 2012

Nanoindentation in Materials Science

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“…In their tests, when the indentation load was increased, the restraining effect of the composite film above the silicon substrate resulted in a large amount of plastic deformation in the substrate, which was sufficient to cause pop-in behavior. 36 The C / a-Si composite films demonstrated sink-in behavior in the indentation tests. Figures 7͑a͒ and 7͑b͒ show the load-depth profile obtained from the C͑50 nm͒ / a-Si͑50 nm͒ / Si-substrate specimen on the Hysitron and the Nano Indenter XP ͑MTS, USA͒ systems, respectively.…”

Section: Resultsmentioning

confidence: 92%

Determination of the strain energy release rate for C/a-Si composite film produced in nanoindentation tests

Han

Huang

et al. 2009

Journal of Applied Physics

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A general mechanical model that describes the contact behavior and deformations arising at all layers (including the substrate) is developed in the present study for multilayer specimens to evaluate the theoretical contact parameters. The governing differential equations for the depth solutions of the indenter tip formed at all layers of the specimen under their contact force and depth are developed individually. These two contact parameters allow the evaluation of the internal stress and strain using the membrane theory. The strain energy release rate can thus be determined if the internal stress is available. The mean value of these pop-in depths is almost constant when operating at various loading rates. The present model is precisely if it has good agreement with experiments. The pop-in internal stress was found to be strongly dependent on the C-film thickness (thus the material properties) but independent of the applied indentation system (thus indentation conditions). The pop-in internal stress and strain energy release rate can be significantly lowered by increasing the C-film thickness. Furthermore, pop-in always formed at a depth near the interface of the C/a-Si composite film and Si substrate.

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“…Interestingly, a few studies have found similar pop-ins during indentation of DLC films on silicon substrates, where the pop-ins were directly attributed to the substrate response [23,24]. These studies distinguished between minor pop-ins due to plastic deformation (at smaller loads) and pop-ins due to phase transformation (at higher loads).…”

Section: 'Effective Indenter'/eha-hhs Approach Applied To A-c:h Filmmentioning

confidence: 93%

Determination of Young's modulus of thin films using the concept of the effective indenter

Herrmann

Richter

2011

Philosophical Magazine

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Since the introduction of a new analytical technique for elastic-plastic indentation experiments, i.e. the model of the 'effective indenter' combined with the Extended Hertzian Approach [J. Phys. D: Appl. Phys. 37 (2004) p. 2761], a number of publications have reported successful determination of the yield strength of bulk materials and thin films with this new approach for a large group of materials, including SiO 2 and a-C:H. However, this approach also allows the determination of the Young's modulus of thin films. In this contribution, we have investigated the extent to which the model of the 'effective indenter' can be used to determine the Young's modulus of films. Thermally grown SiO 2 and a-C:H films deposited by PECVD were used. For each sample, elastic-plastic load-depth curves (Berkovich) for a series of varying maximum loads were analyzed to gather data regarding the ratio of contact depth to film thickness. For each unloading curve, the shape of the effective indenter and the Young's modulus value of the film were determined. Modulus values were in reasonable agreement with those obtained by elastic spherical indentations if the contact depth to film thickness ratio was sufficiently low. The approach used in the paper fails if the latter ratio exceeds a certain limit, which is specific for the given combination of substrate and film material. Physical mechanisms are discussed as reasons for this behavior.

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Deformation behaviour of DLC coatings on (111) silicon substrates

Cited by 20 publications

References 20 publications

Effect of the Spherical Indenter Tip Assumption on the Initial Plastic Yield Stress

Effect of the Spherical Indenter Tip Assumption on the Initial Plastic Yield Stress

Determination of the strain energy release rate for C/a-Si composite film produced in nanoindentation tests

Determination of Young's modulus of thin films using the concept of the effective indenter

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