Deformation characteristics of polysynthetically twinned (PST) crystals during creep at 1150 K

Wegmann, Gerhard; Suda, Takahiro; Maruyama, Kouichi

doi:10.1016/s0966-9795(99)00081-3

Cited by 28 publications

(18 citation statements)

References 23 publications

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“…[1][2][3][4][5][6][7] Extensive research works have focused on developing the advanced aerospace structure and propulsion systems. Those candidates are mostly the compounds with metallic bonding such as NiAl, [8][9][10] Ni 3 Al [11][12][13][14][15][16] and TiAl [17][18][19][20][21][22][23] due to the combination of high melting temperature, low density and excellent corrosion resistance. Despite their brittleness at low temperatures, they provide an ideal basis for further development as high-temperature structural materials.…”

Section: Introductionmentioning

confidence: 99%

Thermal Conductivity of Intermetallic Compounds with Metallic Bonding

et al. 2002

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Thermal conductivity is one of the key parameters required for high-temperature structural applications of metallic materials. In this overview, the thermal conductivity of intermetallic compounds are extensively described based mainly on our past works, since there had been less works in this research field. Emphasis is placed on the B2 and the L1 2 compounds with metallic bonding such as NiAl, Ni 3 Al, etc., which have been attracting attention for engineering applications at higher temperatures. The thermal conductivity data have been accumulated for the intermetallic compounds, and the phenomenological aspects are reviewed in detail as a function of alloy composition, constituent and temperature. The Wiedemann-Franz law is applicable to the intermetallic compounds, indicating that the carrier of thermal conduction is an electron rather than a phonon. The thermal conductivity of an intermetallic compound with the ordered crystal structure is characterized as an enhancement due to ordering with reference to the basic contribution of solid solution with the disordered crystal structure. It is demonstrated that the thermal conductivity of intermetallic compounds is reduced by the addition of a third element, and this subject is also covered.

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Section: Introductionmentioning

confidence: 99%

Thermal Conductivity of Intermetallic Compounds with Metallic Bonding

et al. 2002

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“…Anisotropy of Ti-rich side alloys is highly pronounced irrespective of whether it is at room temperature (Werwer and Cornec 2006) or at high temperature (Wegmann et al 2000). Room temperature plastic anisotropy of similar Ti-rich TiAl lamellar single crystals has also been discussed in Zambaldi et al (2011), Zambaldi and Raabe (2010), and among others, where they showed that the maximum yield stress occurs when lamellar direction is perpendicular to the compression axis i.e φ = 90°, stress is the minimum when approximately φ = 45°, and at φ = 0°stress is in between (Brockman 2003, Fujiwara et al 1990).…”

Section: Anisotropy In Ti-rich Sidementioning

confidence: 99%

Reviewing the class of Al-rich Ti-Al alloys: modeling high temperature plastic anisotropy and asymmetry

Chowdhury

Altenbach

Krüger

et al. 2017

Mech Adv Mater Mod Process

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In the last decades, the class of Ti-rich TiAl-based intermetallic materials has replaced many contemporary alloys till 900°C. Due to higher oxidation resistance, 20% lower density and higher (about 150°C more) operating temperature possibility of Al-rich TiAl alloys over Ti-rich side, phases from the Al-rich region of this alloy system are considered to be highly potential candidates for high temperature structural applications. Although there are a lot of works about Ti-rich alloys, however, investigation from the Al-rich side is very limited. This work reviews the class of Al-rich TiAl alloys in terms of phases, microstructures, morphology, deformation mechanisms, mechanical behaviors along with a possible micromechanical modeling approach. Single crystal like Ti-61.8at.%Al alloy from the Al-rich family has been chosen as an example for modeling high temperature anisotropy and tension-compression asymmetry. A possible comparison with Ti-rich side is also presented.

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“…[4,[12][13][14] The control of lamellar orientation is another important way to improve creep resistance of lamellar materials. Studies of creep resistance by Wegmann et al, [15,16] Shiratori et al, [17] Parthasarathy et al, [18] and Kim et al [19] revealed anisotropic behavior depending on the stress axis. Hard orientations with lamellar boundaries perpendicular or parallel to the stress axis showed longer creep life and superior creep resistance compared to other orientations.…”

Section: Introductionmentioning

confidence: 98%

Microstructure stability during creep deformation of hard-oriented polysynthetically twinned crystal of TiAl alloy

Kim

Maruyama

2003

Metall Mater Trans A

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The hard-orientated polysynthetically twinned (PST) crystal with the lamellar plates oriented parallel to the compression axis was deformed at 1150 K under the applied stress of 158 to 316 MPa. Microstructural changes were examined quantitatively for the PST crystal during creep deformation. In the as-grown PST crystal of the present study, proportions of ␣ 2 /␥, true twin, pseudotwin, and 120 deg rotational fault interfaces were 12, 59, 12, and 17 pct, respectively. After creep deformation, lamellar coarsening by dissolution of ␣ 2 lamellae and migration of ␥/␥ interfaces were observed. The acceleration of creep rate after the minimum strain rate in the creep curve was attributed to the lamellar coarsening and destruction of lamellar structure during the creep deformation. Thirty-two percent of ␣ 2 /␥ interfaces, 51 pct of true twin interfaces, 74 pct of pseudotwin interfaces, and 80 pct of 120 deg rotational faults disappeared after 4 pct creep strain at 1150 K. The ␣ 2 /␥ interface was more stable than ␥/␥ interfaces during the creep deformation. The pseudotwin interface and 120 deg rotational fault were less thermally stable than the true twin interface for ␥/␥ interfaces.

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Deformation characteristics of polysynthetically twinned (PST) crystals during creep at 1150 K

Cited by 28 publications

References 23 publications

Thermal Conductivity of Intermetallic Compounds with Metallic Bonding

Thermal Conductivity of Intermetallic Compounds with Metallic Bonding

Reviewing the class of Al-rich Ti-Al alloys: modeling high temperature plastic anisotropy and asymmetry

Microstructure stability during creep deformation of hard-oriented polysynthetically twinned crystal of TiAl alloy

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