Degradation of Cu-Al wire bonded contacts under high current and high temperature conditions using in-situ resistance monitoring

Rongen, R.T.H.; IJzerloo, A. van; Mavinkurve, A.; O'Halloran, G.M.

doi:10.1109/ectc.2015.7159780

Cited by 10 publications

(1 citation statement)

References 8 publications

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“…Failures caused by corrosion will limit the application range. 15,16 Huang et al 17 showed that the fracture position of all such solder joints was between the aluminum side and solder layer, while the strength of aluminum-containing solder joints was the highest. After corrosion, the order of the shear strength decrease rate of the solder joint was the same as that of the solder.…”

Section: Introductionmentioning

confidence: 99%

Effect of In on Corrosion Performance of Zn-15Al-5Cu-xIn Solders

Yan

Ren

2021

Journal of Elec Materi

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The salt spray test has been used to study the effect of adding In on the corrosion performance of Zn-15Al-5Cu-xIn (x = 0, 1, 3, and 5, where x is the mass percentage) solder alloys. The focus was on the microstructure and corrosion properties of the alloy. The results of scanning electron microscopy (SEM), energy-dispersive spectrometry (EDS), x-ray diffraction (XRD) analysis, and differential scanning calorimetry (DSC) revealed the distributed formation of In-based solid solution. Corrosion performance tests on the Zn-15Al-5Cu-xIn solders revealed the influence of In on the corrosion performance; addition of 3% In resulted in the solder with the highest corrosion potential and slowest corrosion rate. The main reason is that more c (CuZn 4) phase with strong corrosion resistance was dispersed and distributed in the solder. Remarkably, when the In content exceeded 3%, it could enrich the dendritic zone of the grains, which could reduce the corrosion resistance of the solder alloy. It is thus concluded that the optimal In content in this alloy system is 3%.

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Section: Introductionmentioning

confidence: 99%