Delamination Risk Evaluation for Plastic Packages Based on Mixed Mode Fracture Mechanics Approaches

Abstract

The growing application of advanced electronic packages under harsh environmental conditions, extreme temperatures especially in automotive applications is often a reason for damage, fatigue, and failure of entire components and systems. Consequently, their thermo-mechanical reliability is one of the most important preconditions for adopting these technologies in industrial applications. To prevent chips from being exposed to the external environment integrated circuits are usually encapsulated into packages. As a result, a microelectronic package is basically a compound of several materials with quite different Young’s moduli and thermal expansion coefficients. Additionally, various kinds of inhomogeneity, residual stresses from several steps of the manufacturing process contribute to interface delaminations, chip cracking, and fatigue of solder interconnects. This paper intends to investigate mixed mode interface delamination phenomena in micro components by using combined numerical investigations by means of nonlinear FEA and experimental investigations. It explains how experimental data were used as input for the quantitative evaluation of fatigue and fracture of microcomponents. Both numerical and experimental investigations provide the basis for understanding and evaluating failure mechanisms especially in solder joints, as well as several polymer material interfaces, and should support further applications for raising the thermo-mechanical reliability of advanced electronic packages.

Advanced Experimental and Simulation Approaches to Meet Reliability Challenges of New Electronics Systems

“…[1] Regardless of this, one major task prior to delamination investigations is the experimental examination of the interface fracture toughness depending on varying externally applied loading conditions-see also Refs. [2,3] Alternatives to handle bimaterial delamination problems are: -SIF evaluation by CTOD techniques as outlined by Sun and Qian, [4] which is also restricted to LEFM. -VCCT [5,6] -restricted to LEFM especially regarding the mode separation of SIF and ERR as described above.…”

High-g impact resistance for epoxy molding compound

“…VT Srikar and Stephen D Sen-turia investigated the failure modes of micro-structure in high-g impact condition using theoretical models [6][7] ; Auersperg et al [8] carried out the delamination risk analysis of plastic packages using the finite element and experimental methods. Lee and Lee [9] investigated hygrothermal fracture of plastic IC package using the commercial finite element software ABAQUS.…”

Combined Fracture, Delamination Risk and Fatigue Evaluation of Advanced Microelectronics Applications towards RSM/DOE Concepts

“…Regardless of this, one major task prior to delamination investigations is the experimental examination of the interface fracture toughness depending on varying externally applied loading conditions -see also [10][11].…”