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The paper addresses the through silicon via (TSV) filling using electrochemical deposition (ECD) of copper. The impact of seed layer nature on filling ratio and void formation will be discussed with respect to via diameter and via depth. Based on the Spherolyte Cu200 the electrolyte for the copper electrochemical deposition was modified for good filling behavior. Thermomechanical modeling and simulation was performed for reliability assessment

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In this paper, we present a complete thermomechanical study of a micromachined gas sensor substrate. The work has been carried out combining coupled electrothermomechanical three-dimensional finite element modelling simulations with electrical, infrared thermography and interferometric microscopy experimental measurements. The performances predicted by simulations, such as the power consumption (heating efficiency in air of 5.7 • C mW −1), the time response (19 ms), the membrane deflection during operation and the preferential failure sites in the micromachined substrate have been confirmed by experience. Their good agreement validates the model, and allows us to consider the adaptability of this design as a micromachined substrate for integrated gas sensors.