Delamination toughness of Cu-EMC interfaces at harsh environment

Abstract

Interfacial delamination has become one of the key reliability issues in the microelectronic industry and therefore is getting more and more attention.

Establishing the critical fracture properties of the die backside-to-molding compound interface

“…Recent approaches to an interfacial test method are promising [9], [25]. The specimens could be made with one of the above described methods.…”

“…First the material behavior which influences the critical stress state changes with temperature and, in case this shall be modeled, it also changes with climate conditions such as moisture or pressure [9].This involves viscoelastic properties of the EMC material which were calculated from DMA measurements in tensile mode, and it involves the coefficient of thermal expansion which was determined by measuring the dimension change of cube shaped EMC specimens using a TMA equipment. Secondly the specimen geometry is complex in the sense that the delaminating area cannot clearly be separated from clamping and loading areas, specifically not to determine the residual stress state that is the stress state before delamination loading is applied.…”