Demonstration of a multichannel optical interconnection by use of imaging fiber bundles butt coupled to optoelectronic circuits

Chiarulli, Donald M.; Levitan, Steven P.; Derr, Paige; Hofmann, Robert; Greiner, Bryan; Robinson, Matt

doi:10.1364/ao.39.000698

Cited by 39 publications

(11 citation statements)

References 4 publications

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“…At the core of the MCM architecture is an optical element built by bonding together two rigid segments of imaging fiber guide. These image guides are produced by Schott Fiber Optics and consist of a dense array of small core fibers arranged in a lattice [13]. Fiber diameters typically range from 5 to 20 microns, yielding core densities of two thousand to fifteen thousand cores per square millimeter.…”

Section: Oe-mcm Crossbar Switch Demonstration Systemmentioning

confidence: 99%

Modeling and simulation of fiber image guide multichip modules for MOEMS applications

Levitan

Kurzweg

Martínez

et al. 2004

MOEMS and Miniaturized Systems IV

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Densely integrated systems in the future will incorporate device and communication technologies that span the domains of digital and analog electronics, optics, micro-mechanics, and micro-fluidics. Given the fundamental differences in substrate materials, feature scale and processing requirements between integrated devices in these domains, it is likely that multi-chip, system-in-package, integration solutions will be required for the foreseeable future. The multi-domain nature of these systems necessitates design tools that span multiple energy domains, time and length scales, as well as abstraction levels. This paper describes a case study of the modeling of a photonic/multi-technology system based on a 3D volumetric packaging technology implemented with Fiber Image Guide (FIG) based technology. It is 64x64 fiber crossbar switch implementation using three Silicon-on-Sapphire mixed signal switch die with flip-chip bonded VCSEL and detector arrays. We show a single end-to-end system simulation of the O/E crossbar working across the domains of free-space and guided wave optical propagation, GaAs O/E and E/O devices, analog drivers and receivers and integrated digital control.

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Section: Oe-mcm Crossbar Switch Demonstration Systemmentioning

confidence: 99%

Modeling and simulation of fiber image guide multichip modules for MOEMS applications

Levitan

Kurzweg

Martínez

et al. 2004

MOEMS and Miniaturized Systems IV

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“…Recently optical interconnections using FIGs have been investigated widely [4], [5], [6]. FIGs are bundles of a large number of individual fibers used to transfer 2-D optical data packets.…”

Section: Fiber Image Guidesmentioning

confidence: 99%

<title>Optical interconnection testbed using fiber image guides</title>

2001

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We present an optical interconnection system that transfers 3-D optical data packets among network nodes using fiber image guides. The fiber image guides (FIGs) are potentially easier to align and package and more flexible in their application than alternative techniques. The testbed system includes a reconfigurable field programmable gate array (FPGA), a transimpedance amplifier (TIA) receiver array, and an optoelectronic very large-scale integrated (OE-VLSI) monolithic smart pixel device. The smart pixel device contains vertical-cavity surface-emitting lasers (VCSELs) and metal-semiconductormetal (MSM) detectors, and performs optical I/Os for the electronic devices. The TIA receiver chip is used with the MSM detectors to convert photodetected current signals into 5V CMOS compatible signals. These components are mounted on a printed circuit board for testing and evaluation of integrated monolithic OEIC designs. We discuss techniques for buttcoupling the fiber image guides to the VCSEL array and optimizing the coupling distance for VCSEL output. The optical signals are transferred most efficiently through the core fibers in FIGs. When the position of the incident beam is near the center of the cladding the power loss is significant. The system demonstrates high data transmission rates over 16 channels with low crosstalk.

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“…Superficially, FIG-based optical interconnects are replacements for lens-based systems [30][31][32][33][34][35][36][37][38], but with added advantages such as going round bends and being impervious to dimensional changes and buckling due to localized heating/cooling of the optical transceive board or module (Fig. 1).…”

Section: Introductionmentioning

confidence: 99%

Critical parameters for parallel interconnects using VCSEL arrays and fiber image guides

Mukherjee

Hadley²,

Geib³

et al. 2003

SPIE Proceedings

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Several thousand glass optical fibers fused together is routinely used as fiber image guides for medical and other image remoting applications. Fiber image guides also offer possibility for flexible optical interconnect links with potentially thousands of bi-directional parallel channels with data rates as high as 10 Gbps per channel, leading to more than Tera bits per second aggregate data transfer rates. A fair number of fiber image guide based link demonstrations using vertical cavity surface emitting lasers have been reported. However, little is known about designable parameters and optimization paradigms for applications to massively parallel optical interconnects. This paper discusses critical optical parameters that characterize a massively parallel link. Experimental characterizations were carried out to explore some of the fundamental interactions between single-mode 850 nm VCSELs and fiber image guides having different numerical apertures, 0.25, 0.55 and 1.00. Preliminary optical simulation results are given. Finally, potential directions for further experimental and analytical explorations, and for applicability into designable link systems are suggested.

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Demonstration of a multichannel optical interconnection by use of imaging fiber bundles butt coupled to optoelectronic circuits

Cited by 39 publications

References 4 publications

Modeling and simulation of fiber image guide multichip modules for MOEMS applications

Modeling and simulation of fiber image guide multichip modules for MOEMS applications

<title>Optical interconnection testbed using fiber image guides</title>

Critical parameters for parallel interconnects using VCSEL arrays and fiber image guides

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