Demonstration of electrical connectivity between self-assembled structures

Rao, Madhav; Lusth, John C.; Burkett, S. L.

doi:10.1116/1.4802914

Cited by 9 publications

(3 citation statements)

References 31 publications

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“…For external driving forces, the rigid parts can be actuated by a magnetic field, capillary force, compressive force, or cell traction force (CTF), where the hinge is only a flexible connection between the rigid parts, and the size of the as‐fabricated device is usually in the micrometer or millimeter scale. In comparison, for internal driving forces, the internal interactions within the hinge part can change its curvature and lead to folding of the rigid parts, which is sometimes referred to as “self‐folding.” The internal interactions could arise from surface tension (capillary force), material expansion/shrinking (strain gradient, phase transition in a shape memory polymer, pneumatic force), bio‐force (cell traction force), ion–solid interactions (focused ion beam), etc. The size of the device can be scaled down to quite a small scale (from millimeters to hundreds of nanometers).…”

Section: Basic Concept and Principles Of The Folding Methodsmentioning

confidence: 99%

“…= 47 or 70 °C), tin/lead (m.p. = 183 °C, Figure c), and other alloys, or polymers, including photoresist, polycaprolactone (PCL, Figure d), and polyimide . Due to the unidirectional capillary force, this folding process is irreversible, i.e., the folded structure cannot recover to its original state by further heating or cooling treatment.…”

Section: Fabrication Techniquesmentioning

confidence: 99%

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Folding 2D Structures into 3D Configurations at the Micro/Nanoscale: Principles, Techniques, and Applications

Liu

Cui

et al. 2018

Advanced Materials

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configurations are no longer sufficient, either in terms of realizing certain crucial functionalities or in performance improvement. Compared to 2D structures, 3D structures have one more dimension, which enables more diversity in structure/ device design and is crucial in realizing richer physical interactions, better performance, and advanced functionalities. For example, to obtain a negative permeability from split ring resonators (SRRs) to construct negative index metamaterial, a vertical configuration of SRRs is needed to couple with the magnetic field, while planar SRRs can only couple with the electric field to obtain a negative permittivity. [4] With respect to device performance, 3D gold helixes [5] have larger polarization contrast than 2D chiral structures, [6] and dynamic 3D microcontainers [7] can realize drug delivery in a much more controllable way than absorption on 2D structures. [8] Therefore, 3D micro/nanostructures are of significant importance in such scenarios, acting as an indispensable supplement to the present 2D micro/nanostructures. However, the fabrication of 3D micro/nanostructures is a formidable challenge with the state-of-the-art equipment, because the traditional planar process cannot be used directly due to its 2D projection nature.Much effort has been devoted in past decades, and significant progress has been demonstrated with 3D micro/nanofabrication, which can be divided into two types of strategies. The first one is brand new technologies/equipment development, including 3D laser direct writing (LDW) [9] and focused ion beam (FIB) [10] processing using two-photon polymerization and ion beam milling/deposition to construct 3D structures. Great scientific advantages have been demonstrated in the fields of mechanics, optics, and biology using these techniques. [11] However, due to their intrinsic point-by-point writing style, the efficiency of LDW and FIB is limited. Moreover, the materials that can be proceeded by the two techniques are usually photoresists (two-photon absorption) and metals (FIB-assisted deposition), and transferring to other materials can be quite challenging in most cases. [5,12] The other strategy is a combination or modification of the technologies in planar processes (including lithography, deposition, and etching) and is referred to as "planar technology" in this review. In this strategy, a variety of 3D fabrication methods have been developed, such as multilayer stacking, [13] oblique angle deposition, [14] and self-aligned Compared to their 2D counterparts, 3D micro/nanostructures show larger degrees of freedom and richer functionalities; thus, they have attracted increasing attention in the past decades. Moreover, extensive applications of 3D micro/nanostructures are demonstrated in the fields of mechanics, biomedicine, optics, etc., with great advantages. However, the mainstream micro/nanofabrication technologies are planar ones; therefore, they cannot be used directly for the construction of 3D micro/nanostructures, making 3D fabrication at the m...

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Section: Basic Concept and Principles Of The Folding Methodsmentioning

confidence: 99%

Section: Fabrication Techniquesmentioning

confidence: 99%

Folding 2D Structures into 3D Configurations at the Micro/Nanoscale: Principles, Techniques, and Applications

Liu

Cui

et al. 2018

Advanced Materials

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“…One of the objectives in introducing the SBSA project in an IC fabrication curriculum was to demonstrate the importance of CAD design in the overall silicon processing sequence and get students started on CAD design. In SBSA, three photomasks were required to obtain the 3D structures (Rao, Lusth, & Burkett, 2013). The three photomasks were labeled: SAC, METAL, and SOLDER.…”

Section: Copyright By Author(s); Cc-by 13mentioning

confidence: 99%

A Solder Based Self Assembly Project In An Introductory IC Fabrication Course

Rao¹,

Lusth

Burkett

2015

AJEE

Self Cite

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Integrated circuit (IC) fabrication principles is an elective course in a senior undergraduate and early graduate student’s curriculum. Over the years, the semiconductor industry relies heavily on students with developed expertise in the area of fabrication techniques, learned in an IC fabrication theory and laboratory course. The theory course gives importance to the physics of manufacturing techniques and is often attached to a subsequent semester laboratory curriculum. The pre-requisite requirement of the theory component for a laboratory course requires students to enroll for two courses in separate semesters and is not an option for all students. Hence, an innovative student project is intended in the theory curriculum to give hands-on experience on the processes. The IC fabrication course is usually associated with high enrollment of students, leading to fewer laboratory experiments. The physics of IC fabrication techniques is important, but few students may perceive the theory as important with no laboratory experience. To improve the course and give students hands-on practice with existing state-of-the-art processing facilities, a tailored project was added to the syllabus. A solder-based self assembly (SBSA) project was introduced in the curriculum for the first time at the University of Alabama in Fall 2011. The student projects were designed in a way to provide an alternative to conventional time-intensive, high cost, and highly tool dependent IC fabrication lab experiments. SBSA forms three dimensional (3D) structures when applied to two dimensional (2D) patterns. The schedule was designed to accommodate theory classes aligned with the fabrication steps and completed by students. The project involved a brainstorming session, a design stage to develop 2D patterns using AutoCAD software, a deposition process, a lithography step, a dip soldering step, a reflow process, scanning electron microscope (SEM) imaging, and a final project presentation. Other processes required to complete the project were performed by the instructor. In general, students showed interest in working in teams, completing the project, and recommended to continuing the SBSA project in future IC fabrication course work. The SBSA project is cost effective and less tool dependent for incorporation in a semester long course. In addition, the project is time effective from both student and instructor perspectives.

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Design of wideband small footprint 3D posts antenna with coupled meta-surface patches

Gupta

Harish

2019

2019 IEEE Asia-Pacific Microwave Conference (APMC)

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Demonstration of electrical connectivity between self-assembled structures

Abstract: Articles you may be interested inSynergistic effect of self-assembled carbon nanopaper and multi-layered interface on shape memory nanocomposite for high speed electrical actuation

Cited by 9 publications

References 31 publications

Folding 2D Structures into 3D Configurations at the Micro/Nanoscale: Principles, Techniques, and Applications

Folding 2D Structures into 3D Configurations at the Micro/Nanoscale: Principles, Techniques, and Applications

A Solder Based Self Assembly Project In An Introductory IC Fabrication Course

Design of wideband small footprint 3D posts antenna with coupled meta-surface patches

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