2021
DOI: 10.1016/j.jcrysgro.2021.126250
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Demonstration of lateral epitaxial growth of AlN on Si (1 1 1) at low temperatures by pulsed reactive sputter epitaxy

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Cited by 12 publications
(3 citation statements)
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“…These vanishing voids indicate a substantial lateral growth rate. [ 12 ] Now the crystallographic quality and surface morphology of this layer is an excellent starting point for the growth of further layers and complex device structures.…”
Section: Resultsmentioning
confidence: 99%
“…These vanishing voids indicate a substantial lateral growth rate. [ 12 ] Now the crystallographic quality and surface morphology of this layer is an excellent starting point for the growth of further layers and complex device structures.…”
Section: Resultsmentioning
confidence: 99%
“…Dadgar et al . demonstrate good values of mosaicity, close to 0.3°, for 250 nm AlN films sputtered on Si(111) at 900 °C. For the fabrication of bulk acoustic-wave filters when a metallic electrode (Pt, Ir, or Ru) is inserted between the Si substrate and the sputtered AlN film, the strong texture of the sputtered metallic film is transmitted to the AlN film and the mosaicity reaches values close to 1° for 2-μm-thick films.…”
Section: Introductionmentioning
confidence: 94%
“…High defect densities and cracking of films exceeding 1 μm in thickness are related issues that still need to be solved in the epitaxy process. , A process window for high-quality growth of GaN/AlN by MSE has already been demonstrated. Careful design of buffer layers and strain management is necessary to successfully grow high-quality and crack-free GaN/AlN on Si. ,, The integration of an Al seed layer into the process flow has proven beneficial to improve the crystal quality of AlN-on-Si grown by various epitaxy technologies. Enhanced surface diffusion and avoiding the formation of SiN x layers promote the adhesion and subsequent growth of AlN layers. However, a thorough investigation of the impact of this seed layer on the film morphology, structural quality, and film polarity of sputtered GaN/AlN/Si(111) stacks has rarely been reported. For wurtzite-type III-nitride-based electronic devices, such as high electron mobility transistors (HEMTs), the polarization direction along the c -axis is a key property that must be controlled reliably as it determines the direction of the internal electrical field and thus the device design.…”
Section: Introductionmentioning
confidence: 99%