Densification of 0·99SnO20·01CuO mixture: Evidence for liquid phase sintering

In Situ Observation and Selective Electrochemical Deposition of Polypyrrole by Scanning Tunneling Microscope

“…In this experiment, we added 1.00 mol% CuO to tin oxide, the density could go up to 6660 kg m −3 , higher than 95% of the theoretical density. The increase in the densification of tin oxide by the addition of CuO is due to the existence of a liquid phase in the Sn-Cu-O 2 system, which was confirmed by Dolet and his collaborators [9,10]. The introduction of CuO to the SnO 2 lattices leads to the formation of oxygen vacancies according to [14,15] 2CuO…”

“…In general, when ε r increases, ρ is high and vice versa, though this need not always hold good. At high temperatures tin oxide does not densify during sintering due to the high vapour pressure of this oxide [9][10][11]. However, when SnO 2 is doped with copper oxide additives, the densification can be improved at this temperature.…”

“…It is reported that CuO can improve SnO 2 densification by forming a reactive liquid phase [9][10][11], but the SnO 2 ·CuO ceramic system is highly resistive, showing no signs of 1 Author to whom any correspondence should be addressed. nonlinearity.…”

Advanced SnO2-Based Ceramics: Synthesis, Structure, Properties

“…The results obtained by isothermal treatments at 1173, 1273 and 1473 K of the (1-x)SnO 2-ionic radii of the two ions are close (0.71 Å for the Sn 4 + and 0.72 Å for the Cu 2 + ) due to their different structures and especially their different valence, the formation of a a solid solution between the two oxides is unlikely to occur. The disappearance of characteristic diffraction lines of copper oxide and the sharp contraction of these samples was assigned to its penetration into the liquid phase (eutectic melt), which facilitates rapid rearrangement of the ions Dolet et al, 1992]. It was observed that in isothermal condition the reaction of CuO reduction, namely: CuO → Cu 2 O takes place at substantially lower temperature compared with the non-isothermal measurements.…”

Microstructure and vacuum arc characteristics of CuO skeletal structure Ag-CuO contact materials

“…In our previous research [13], it was found that the CuO additives in Ag-SnO 2 materials show good sintering activity, the CuO particles can be sintered together under certain sintering process. Meanwhile, it has been reported that the addition of CuO in the Ag-SnO 2 materials causes liquid phase sintering at moderate temperatures [14,15]. In previous studies, all researchers were investigated CuO particles structure Ag-CuO contact materials, AgCuO materials with other CuO microstructure is no reported [16e18].…”