Departure from Natural Convection (DNC) in Low-Temperature Boiling Heat Transfer Encountered in Cooling Microelectronic LSI Devices

Pool Boiling Experiments on a Nano-Structured Surface

“…In the nano-scale regimes (e.g., on MWCNTs), the continuum assumptions may not be valid, and the transport mechanisms can be counter-intuitive to those based on continuum models. Additional investigations are therefore needed to conclusively verify the mechanisms responsible for extending the wall superheat On a nanostructured surface, the contact line is "pinned" [18] causing the area under the bubble to be bigger than for a smooth surface. This can effectively enhance the rate of heat transfer for each bubble and also increase the bubble departure frequency.…”

“…The data by Honda et al [8] was obtained at wall superheats at which the size of the pin fins are comparable in size to range of nucleating cavities ( order of 10 m). The data by Oktay [18], Liter and Kavinay [20], Hwang and Kavinay [21] as well as Chang and You [19] were obtained for microporous and porous surfaces. These surfaces have a range of available cavity sizes that enhance nucleation site density.…”

Enhanced Boiling Heat Transfer from Micro-Pin-Finned Silicon Chips

“…Since the 1970s, a number of active studies have dealt with the enhancement of boiling heat transfer from electronic components by use of surface microstructures that were fabricated directly on a silicon chip or on a simulated chip. These include a sand-blasted and KOH treated surface (Oktay 1982), a "dendritic heat sink" (brush-like structure) (Oktay and www.intechopen.com Schemekenbecher 1972), laser drilled cavities (3-15μm in mouth dia.) (Hwang and Moran 1981), re-entrant cavities (0.23-0.49 mm in mouth dia.)…”

Experimental study of nucleate pool boiling of FC-72 on micro-pin-finned surface under microgravity

“…These include a dendritic heat sink [2], laser-drilled holes [3], micro-re-entrant cavities (1-3 lm in mouth dia.) [4], porous surfaces formed by spraying and painting of alumina particle [5] or copper particle (3-10 lm in dia.)…”