Dependence of recrystallization on grain morphology of Sn-based solder interconnects under thermomechanical stress

Chen, Hongtao; Li, Jue; Li, Mingyu

doi:10.1016/j.jallcom.2012.06.087

Cited by 12 publications

(3 citation statements)

References 14 publications

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“…The grain refinement after thermal cycling indicates recrystallisation, which was induced by the repeated plastic and creep deformation. The same phenomenon was reported in [21, 22], where it was stated that the grain refinement of an Sn‐based solder layer was caused by the repeated plastic and creep deformation during thermal cycling. The grain refinement of the Al sheet indicates that it absorbed the thermal strain generated by the thermal cycling due to the thermal mismatch between the SiC chip and Cu plate.…”

Section: Resultssupporting

confidence: 78%

Highly reliable joining for high‐temperature power modules: Ni–Sn DSLID with an Al sheet

Ito

Kuwahara

Kadoura

et al. 2019

IET Power Electronics

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Highly reliable operation at high temperatures is required for next-generation power modules in electric vehicles. We propose a joining concept involving nickel-tin (Ni-Sn) double solid-liquid interdiffusion with an aluminium (Al) sheet (Ni-Sn DSLID/Al), which enables the production of modules with high thermal reliability. The use of Ni-Sn DSLID/Al joint as bonding layers for a large thermal coefficient mismatch [silicon (Si) chip: 3.9 × 10 −6 K −1 , copper electrode plate: 16.5 × 10 −6 K −1 ] effectively decreased the compressive stress to 250 MPa in the Si chip, compared with that of a conventional Ni-Sn SLID joint (500 MPa) after joining. Moreover, the stress was relaxed when heating to 200°C during thermal cycling (from −40 to 200°C), due to the plastic and creep deformations of the inserted Al sheet. In addition, Ni-Sn DSLID/Al joint suppressed crack propagation during thermal cycling and exhibited higher thermal durability than Ni-Sn SLID and Sn-10% antimony solder joints up to 500 cycles, due to the higher resistances of the plastic and creep deformations of the inserted Al sheet. The present concept demonstrates great potential for use in fabricating joints for next-generation power modules.

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Section: Resultssupporting

confidence: 78%

Highly reliable joining for high‐temperature power modules: Ni–Sn DSLID with an Al sheet

Ito

Kuwahara

Kadoura

et al. 2019

IET Power Electronics

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show abstract

“…The recrystallized volume gradually expands with increasing testing time as the cyclic deformation of the solder interconnections provides the driving force for the recrystallization. Several investigations [31][32][33] have reported the similar solder recrystallization phenomena. It seems that once the recrystallization is initiated, it facilitates the crack propagation by providing a network of high-angle grain boundaries along which the cracks can easily propagate (intergranular fracture).…”

Section: Failure Mechanisms Under Single Loading Conditionsmentioning

confidence: 62%

“…Besides, the failure mechanisms of the combined loading tests are covered by next section. Under thermal (temperature) cycling, the crack nucleation and propagation of solder interconnections are highly intluenced by the composition of solder alloy, the microstructure formed after retlow process, and the microstructural evolution during testing or field use [30][31][32][33].…”

Section: Failure Mechanisms Under Single Loading Conditionsmentioning

confidence: 99%

Improved methods for development of high reliability electronics

Dong

Vuorinen

et al. 2014

2014 IEEE Aerospace Conference

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To meet the critical reliability requirements of aerospace electronics, reliability design needs to be integrated into the early stage of product design process. In this paper the role of finite element analysis, thermodynamic calculation, and microstructural simulation in reliability design are introduced, followed by the discussion of failure oriented accelerated tests with emphasis on failure mechanisms. The typical failure mechanisms of three single loading tests as well as two combined thermal and mechanical loading tests are covered. Lastly, the challenges in reliability assessment and failure analysis of MEMS devices are discussed through two case studies, MEMS microphone and gyroscope.

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The investigation of interfacial and crystallographic observation in the Ni(V)/SAC/OSP Cu solder joints with high and low silver content during thermal cycling test

Lee

Chen

Chou

et al. 2015

J Mater Sci: Mater Electron

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Dependence of recrystallization on grain morphology of Sn-based solder interconnects under thermomechanical stress

Cited by 12 publications

References 14 publications

Highly reliable joining for high‐temperature power modules: Ni–Sn DSLID with an Al sheet

Highly reliable joining for high‐temperature power modules: Ni–Sn DSLID with an Al sheet

Improved methods for development of high reliability electronics

The investigation of interfacial and crystallographic observation in the Ni(V)/SAC/OSP Cu solder joints with high and low silver content during thermal cycling test

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