1999
DOI: 10.1080/10584589908210165
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Deposition and annealing of lead scandium tantalate thin films for high performance thermal detector arrays

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Cited by 11 publications
(14 citation statements)
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“…The PST was deposited by sputtering. More details have been published elsewhere [3]. The as-deposited wafer was cut into several pieces of squares about 10 mm × 10 mm, and each piece was then subjected to a series of RTA and structural characterisation processes.…”
Section: Methodsmentioning
confidence: 99%
“…The PST was deposited by sputtering. More details have been published elsewhere [3]. The as-deposited wafer was cut into several pieces of squares about 10 mm × 10 mm, and each piece was then subjected to a series of RTA and structural characterisation processes.…”
Section: Methodsmentioning
confidence: 99%
“…The PST was deposited by sputtering in a custom sputtering system which uses dual 8'' diameter RF magnetron sputtering targets in an argon/10% oxygen atmosphere. More details have been published elsewhere [6][7]. The as-deposited wafer was cut into several pieces of squares about 10 mm x mm, and each piece was then subjected to a series of RTA and structural characterisation processes.…”
Section: Methodsmentioning
confidence: 99%
“…Todd et. Al [6][7] reported growth of perovskite PST at 530 °C by using sputtering techniques. However, in-situ perovskite PST sputtering at elevated temperature can lead to difficulties with lead compositional control and problems with equipment reliability.…”
Section: Introductionmentioning
confidence: 99%
“…Sputtering deposition was carried out in a custom sputtering system which uses dual RF magnetron sputtering targets in an argon/10% oxygen atmosphere. More details have been published elsewhere [4,5]. Films were deposited at 300 °C For sol-gel deposition, precursors were first prepared.…”
Section: Methodsmentioning
confidence: 99%
“…3H 2 O : IPA 1g:1ml. Ta(OEt) 5 and Sc(OAc) 3 was mixed in IPA with the ratio of Ta(OEt) 5 : IPA 1g: 60ml. A lead zirconate titanate (PZT) layer was first coated on a Pt/Ti/SiO 2 /Si substrate as a seeding layer in an attempt to reduce PST crystallisation temperature.…”
Section: Methodsmentioning
confidence: 99%