Deposition and Annealing of Ultrathin Ta[sub 2]O[sub 5] Films on Nitrogen Passivated Si(100)

Son, Kirak; Mao, A. Y.; Hess, D.A.; Brown, Lola; White, John; Kwong, Dim‐Lee; Roberts, David A.; Vrtis, Raymond N.

doi:10.1149/1.1390677

Cited by 7 publications

(2 citation statements)

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“…There is noticeable broadening, slightly lower intensity (-5%) and barely visible evidence of a low BE feature, gray area marked with an arrow in spectrum (b), after annealing. This data indicates, as reported in previous work [16], that nitriding Si(100) inhibits reactions involving the formation of SiO and reduction of tantalum oxide during both the Ta205 film deposition and vacuum annealing steps.…”

Section: Resultssupporting

confidence: 89%

Study of Thermal Stability of Cvd Ta₂0₅/Si Interface

et al. 1999

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Section: Resultssupporting

confidence: 89%

Study of Thermal Stability of Cvd Ta₂0₅/Si Interface

et al. 1999

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“…2c showing the O 1s spectra centered at 531.4 eV, both coatings mainly consist of Ta 2 O 5 . 47,48 Moreover, from Fig. 2b for the Ir 4f spectra, there is no Ir signal for anode B, while the Ir 4f 7/2 and 4f 5/2 peaks are clearly visible for anode A, which are centered at 61.1 and 63.9 eV, respectively.…”

Section: Resultsmentioning

confidence: 92%

The Degradation Behavior of Brightener on Dimensionally Stable Anodes during the Copper Electrodeposition

Lin¹,

Yen²,

Hu³

2019

J. Electrochem. Soc.

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This study shows the first work that in the copper electroplating bath containing brighteners, the degradation and lifetime of brighteners are mainly determined by the mixed metal oxide (MMO) coating on the anode. We demonstrate that the depolarizing ability and lifetime of bis-3-sulfopropyl-disulfide (SPS), a typical brightener in the copper electroplating bath, are strongly affected by the oxidative activity of the anode. Here, the commercially available IrO 2 -based and Ta 2 O 5 -based dimensionally stable anodes (DSA) are employed in the Cu plating, and the oxidation rate of SPS during the deposition is analyzed. The results reveal the prolonged depolarizing ability and lifetime of SPS in the plating bath when the relatively inert anode, Ta 2 O 5 -DSA, is used. The degradation rate of brighteners can be quantified by the voltammetric stripping method and consequently, the variation in the brighteners activity during electrodeposition can be precisely tracked to ensure their functions. Moreover, the inert anode is highly recommended to prolong the function and lifetime of SPS, which is cost-effective and beneficial for circumventing the bath aging issue.

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Effect of a silicon nitride buffer layer on the electrical properties of tantalum pentoxide films

Wang

et al. 2010

Microelectronic Engineering

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Deposition and Annealing of Ultrathin Ta[sub 2]O[sub 5] Films on Nitrogen Passivated Si(100)

Cited by 7 publications

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Study of Thermal Stability of Cvd Ta₂0₅/Si Interface

Study of Thermal Stability of Cvd Ta₂0₅/Si Interface

The Degradation Behavior of Brightener on Dimensionally Stable Anodes during the Copper Electrodeposition

Effect of a silicon nitride buffer layer on the electrical properties of tantalum pentoxide films

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Deposition and Annealing of Ultrathin Ta[sub 2]O[sub 5] Films on Nitrogen Passivated Si(100)

Cited by 7 publications

References 0 publications

Study of Thermal Stability of Cvd Ta205/Si Interface

Study of Thermal Stability of Cvd Ta205/Si Interface

The Degradation Behavior of Brightener on Dimensionally Stable Anodes during the Copper Electrodeposition

Effect of a silicon nitride buffer layer on the electrical properties of tantalum pentoxide films

Contact Info

Product

Resources

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Study of Thermal Stability of Cvd Ta₂0₅/Si Interface

Study of Thermal Stability of Cvd Ta₂0₅/Si Interface