The annealing behavior of amorphous, hydrogenated silicon carbide films in the range 400-900°C was studied by optical characterization methods, 15 N hydrogen profiling, and defect profiling using a variable energy positron beam. The films were deposited in an electron cyclotron resonance chemical vapor deposition system using ditertiary butyl silane ͓SiH 2 ͑C 4 H 9 ͒ 2 ͔ as the monosource for silicon and carbon. As-deposited films were found to contain large concentrations of hydrogen, both bonded and unbonded. Under rapid thermal annealing in a N 2 atmosphere, the bonded hydrogen effuses giving rise to additional Si-C bond formation and to film densification. After annealing at high temperatures in N 2 , a marked decrease in the total hydrogen content is observed. After annealing in vacuum, however, the hydrogen effusion promotes void formation in the films.