Deposition Mechanism of Electroless Pd Plating Using Formic Acid as a Reducing Agent.

Uchida, Ei; Okada, Takashi; Nawafune, Hidemi; Nakao, Seiichiro; Mizumoto, Shozo

doi:10.4139/sfj.50.469

Cited by 4 publications

(1 citation statement)

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“…Pd nuclei were deposited on the outer surface of the tube by sensitization and activation treatments with stannous chloride and Pd chloride solutions, respectively, with the process repeated three times. The electroless Pd plating was then performed using a formic acid electroless plating solution [18] summarized in Table I for inhibiting the formation of defects by generated gas bubbles during the plating. The deposition temperature was adjusted at 323, 333 and 343 K to control the Pd deposition rate with mechanical stirring.…”

Section: Methodsmentioning

confidence: 99%

Preparation of thin and dense electroless-plated Pd membrane by controlling Pd deposition behavior

Miyamoto

Okuda

Oumi

et al. 2011

Trans. Mat. Res. Soc. Japan

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Electroless Pd plating at different deposition temperatures was investigated to control Pd deposition behavior for preparing a much thinner Pd membrane to reduce Pd usage and achieve high hydrogen permeation flux. The deposition temperature directly influenced on the membrane thickness uniformity and defect formation. In our experimental condition, a thin Pd electroless-plated membrane with a thickness of 3 m could be prepared at 333 K using a formic acid bath. It was found that this membrane showed no leakage of helium and high H 2 permeation flux. The rate-limiting step of Pd deposition during the electroless plating must be one of the important factors for preparing the thinner Pd plating membrane with no pinholes.

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Section: Methodsmentioning

confidence: 99%