Deposition of thin films based on silica on polycarbonates by pulsed dielectric barier discharge

Abstract

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Deposition of silicon oxide film from tetraethoxysilane using a pulsed dielectric barrier discharge

“…These elements were described in more detail in our former paper [11,12]. In this paper, the reactor being the main part of the equipment is described briefly (Fig.…”

“…Various deposition technologies for producing thin films can be used including plasma techniques based on microwave and radio-frequency discharges [1][2][3][4][5][6], dielectric barrier discharges (DBD) [7][8][9], atmospheric pressure glow discharges (APG) [10] and pulsed dielectric barrier discharges (PDBD) [11][12][13][14]. DBD, APG and PDBD are usually generated at atmospheric pressure, however, for the film deposition under DBD conditions, the substrate must be heated up to temperatures 100÷400 • C. That temperature range is too high for PC substrates, whereas on the cold surfaces, silicon oxide film cannot be obtained.…”

Thin film deposition on powder surfaces using atmospheric pressure discharge

“…Therefore, batch processing can be avoided and treatment processes can be easily integrated into production lines. For more than ten years the deposition of organosilicon layers on flat substrates has been studied by the use of various monomers [2,3]. In this paper, the deposition of silicon containing thin films on powder particles is described.…”