2017
DOI: 10.1016/j.sna.2017.04.007
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Deposition of ZnO thin films by RF&DC magnetron sputtering on silicon and porous-silicon substrates for pyroelectric applications

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Cited by 9 publications
(6 citation statements)
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“…K. Cicek et al formed ZnO on PS and silicon utilizing the RF&DC magnetron sputtering technique with a flow rate of Ar and O 2 at 120 W power. They found that a pyroelectric coefficient of 8.2 can be achieved for deposits on PS, which is more than ~40 times higher than the one on Si substrate [17].…”
Section: Introductionmentioning
confidence: 98%
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“…K. Cicek et al formed ZnO on PS and silicon utilizing the RF&DC magnetron sputtering technique with a flow rate of Ar and O 2 at 120 W power. They found that a pyroelectric coefficient of 8.2 can be achieved for deposits on PS, which is more than ~40 times higher than the one on Si substrate [17].…”
Section: Introductionmentioning
confidence: 98%
“…Additionally, a sensor based on ZnO/PSNW (zinc oxide on porous silicon nanowires) showed excellent gas sensing performance for various NO 2 concentrations (5-50 ppm), reaching a high electrical resistance rate of 35% for 50 ppm of NO 2 [16]. Furthermore, studies revealed a pyroelectric coefficient in ZnO/PS 40 times higher than in ZnO/c-Si and a pyroelectric voltage as high as 2.4 V [17].…”
Section: Introductionmentioning
confidence: 99%
“…The maximum voltage response was obtained for a line width of 30 μm and ZnO thickness of 1µm. Cieck et al [ 14 ] deposited ZnO thin films by RF&DC magnetron sputtering on silicon and porous silicon (PS) substrates for pyroelectric applications. Due to PS’s large internal area, low thermal conductivity, and preferred c -axis orientation, a pyroelectric coefficient of 8.2 could be achieved (about 40 times higher than that on silicon substrate).…”
Section: Introductionmentioning
confidence: 99%
“…For deposition of ZnO various physical and chemical methods, such as RF magnetron sput-tering [10,11], spray pyrolysis [12,13], chemical vapour deposition (CVD) [14], metal organic chemical vapour deposition (MOCVD) [5,15], sol-gel [16][17][18][19], chemical bath deposition (CBD) [20][21][22][23][24][25], successive ionic layer adsorption and reaction (SILAR) [20,[26][27][28] and atomic layer deposition (ALD) [29][30][31][32][33], have been used. Chemical methods are attractive because they are simple and do not require complicated expensive arrangements.…”
Section: Introductionmentioning
confidence: 99%