1992
DOI: 10.1149/1.2069353
|View full text |Cite
|
Sign up to set email alerts
|

Deposition, Structure, and Properties of Cermet Thin Films Composed of Ag and Y‐Stabilized Zirconia

Abstract: Ag1-=[(Y20~)0.1(ZrO2)0.9]= (YSZ) cermet thin films have been deposited by reactive magnetron cosputtering from Ag and Zr/Y targets in Ar-O2 mixtures. The deposition conditions were such that the YSZ component in the films was fully oxidized. The film densities varied from =75% to >85% as the total pressure was decreased from 20 to 5 mTorr. Film resistivities p varied with Ag volume fraction fag from 5 • 10 -6 ~3-cm to >109 ~-cm. For fag < 0.4, p decreased rapidly with increasing fag. For fag > 0.4, p decreased… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
4
1

Citation Types

0
17
0

Year Published

1992
1992
2013
2013

Publication Types

Select...
7

Relationship

0
7

Authors

Journals

citations
Cited by 39 publications
(17 citation statements)
references
References 12 publications
0
17
0
Order By: Relevance
“…In spite of this interesting finding, however, this approach seems to have significant problems to be used for fabricating nanoporous cermet electrodes. As observed in other reports on low‐temperature processed thin film nanocoomposites, 13–18 massive metal agglomeration was observed after the reduction. In Fig.…”
Section: Resultsmentioning
confidence: 94%
See 2 more Smart Citations
“…In spite of this interesting finding, however, this approach seems to have significant problems to be used for fabricating nanoporous cermet electrodes. As observed in other reports on low‐temperature processed thin film nanocoomposites, 13–18 massive metal agglomeration was observed after the reduction. In Fig.…”
Section: Resultsmentioning
confidence: 94%
“…Especially, the latter was studied intensively in the field of the micro‐SOFC by using thin film deposition techniques such as sputtering, 15–18 pulsed‐laser deposition (PLD), 14 and spray pyrolysis 13,14 because the ceramic network in the nanocomposite was expected to retain the dispersion of the metal particles as in conventional SOFCs 1,19 . However, in contrast to expectation, massive metal phase agglomeration was observed after reduction or thermal treatment regardless of the deposition methods, which leads to the loss of conductivity and poor high‐temperature stability of electrodes 13,15–18 . It was postulated that the larger driving force for agglomeration associated with smaller metal grains is the main cause of the severe agglomeration 13,17 .…”
Section: Introductionmentioning
confidence: 99%
See 1 more Smart Citation
“…1,10 To obtain nano-structured electrodes for thin electrolytes, most of thin film base SOFCs use single phase noble metal electrodes such as porous Pt fabricated by sputtering, 4,6,8,10,12 but the metal coarsening at operating temperatures eventually leads to serious problems such as the reduction of the triple phase boundary length and thus degradation of the cell performance. 10,12 Therefore, ceramic-metal composites (cermets) fabricated by thin film deposition methods 1,[13][14][15][16][17][18][19][20][21][22] were investigated actively to prevent the metal coarsening since the ceramic network in the nano-composite is expected to retain the excessive metal grain growth 6,23 as in conventional SOFCs. In some cases, desirable microstructures, such as a nano-porous structure and an interpenetrating nano-composite structure, 19,22 as well as promising electrochemical performances, such as lower overpotentials and electrode resistances, [20][21][22] were reported.…”
Section: Introductionmentioning
confidence: 99%
“…In some cases, desirable microstructures, such as a nano-porous structure and an interpenetrating nano-composite structure, 19,22 as well as promising electrochemical performances, such as lower overpotentials and electrode resistances, [20][21][22] were reported. However, in many cases, even more massive metal phase agglomeration was observed after the reduction or thermal treatments of the thin film composites regardless of the deposition methods, 1,13,[15][16][17][18] which leads to the loss of the connectivity and the poor high temperature stability of electrodes.…”
Section: Introductionmentioning
confidence: 99%