Depth-sensing ductile and brittle deformation in 3C-SiC under Berkovich nanoindentation

Zhao, Liang; Zhang, Junjie; Pfetzing, Janine; Alam, Mohd; Hartmaier, Alexander

doi:10.1016/j.matdes.2020.109223

Cited by 34 publications

(13 citation statements)

References 42 publications

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“…In the present work, nanoindentation into the (001) surface of a 3C-SiC single-crystal was simulated with a finite element (FE) model, see Figure 2. The indenter geometry and the maximum displacement were set to match those of previously published experimental work [29] such that a quantitative comparison of the force-displacement curves was possible. The FE models of nanoindentation tests were created following the strategy of Zhao et al [29].…”

Section: Parameter Identification By An Inverse Methodsmentioning

confidence: 99%

“…The indenter geometry and the maximum displacement were set to match those of previously published experimental work [29] such that a quantitative comparison of the force-displacement curves was possible. The FE models of nanoindentation tests were created following the strategy of Zhao et al [29]. The model consists of a Si substrate with a top layer of 3C-SiC.…”

Section: Parameter Identification By An Inverse Methodsmentioning

confidence: 99%

“…Figure 4 depicts different load-indentation depth curves resulting from the FE simulations with the material parameters obtained from the inverse analysis in comparison to experimental curves taken from the literature [29]. The experimental curve for a maximum indentation depth of 105 nm was used for the inverse analysis, as described above, yielding the material parameters given in Table 1.…”

Section: Model Validationmentioning

confidence: 99%

“…The initial load-depth curve shows a behavior of P ∝ h 3/2 , where P is the load, and h is the depth, indicating an elastic Hertzian contact at small depths. For validation purposes, the Young's modulus and the hardness were calculated from the unloading stage of the load-depth curves using the Oliver-Pharr method [31,32], which has been widely used to identify these material parameters [29,33]. The experimentally derived Young's modulus and hardness were 440 GPa and 39 GPa, respectively.…”

Section: Model Validationmentioning

confidence: 99%

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Finite Element Modeling of Brittle and Ductile Modes in Cutting of 3C-SiC

et al. 2021

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Machining of brittle ceramics is a challenging task because the requirements on the cutting tools are extremely high and the quality of the machined surface strongly depends on the chosen process parameters. Typically, the efficiency of a machining process increases with the depth of cut or the feed rate of the tool. However, for brittle ceramics, this easily results in very rough surfaces or even in crack formation. The transition from a smooth surface obtained for small depths of cut to a rough surface for larger depths of cut is called a brittle-to-ductile transition in machining. In this work, we investigate the mechanisms of this brittle-to-ductile transition for diamond cutting of an intrinsically brittle 3C-SiC ceramic with finite element modeling. The Drucker–Prager model has been used to describe plastic deformation of the material and the material parameters have been determined by an inverse method to match the deformation behavior of the material under nanoindentation, which is a similar loading state as the one occurring during cutting. Furthermore, a damage model has been introduced to describe material separation during the machining process and also crack initiation in subsurface regions. With this model, grooving simulations of 3C-SiC with a diamond tool have been performed and the deformation and damage mechanisms have been analyzed. Our results reveal a distinct transition between ductile and brittle cutting modes as a function of the depth of cut. The critical depth of cut for this transition is found to be independent of rake angle; however, the surface roughness strongly depends on the rake angle of the tool.

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Section: Parameter Identification By An Inverse Methodsmentioning

confidence: 99%

Section: Parameter Identification By An Inverse Methodsmentioning

confidence: 99%

Section: Model Validationmentioning

confidence: 99%

Section: Model Validationmentioning

confidence: 99%

See 2 more Smart Citations

Finite Element Modeling of Brittle and Ductile Modes in Cutting of 3C-SiC

et al. 2021

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“…Ordinary polycrystalline materials have been difficult to meet this requirement [4], while single-crystal materials have wide application prospects [5,6], which eliminates the lateral grain boundary and the electrons can move without obstacles [7], so that it has good fidelity performance and high-speed propagation performance. Some single-crystal materials have almost no ductility in traditional machining, with hard and brittle characteristics, while single-point diamond turning (SPDT) can make single-crystal materials in ductile domain machining [8,9]. Because of the high cost of diamond tools, in the case of ensuring the surface quality of single-crystal workpieces in SPDT, it is also necessary to improve the wear resistance of diamond tools, which makes the research on single-crystal materials and diamond tools endless.…”

Section: Introductionmentioning

confidence: 99%

Generation Mechanism and Dual Dynamic Simulations of Surface Patterns in Single-Point Diamond Turning of Single-Crystal Copper

Xiong¹,

Chen²,

Dai³

et al. 2021

Preprint

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Single-crystal copper (Cu), whose atom arrangement is in the same direction and has no grain boundary, is widely used in defense technology, civil electronics and network communication. As a diamond turnable material, fan-shaped patterns appear on the machined surface, which affects the machined surface quality and the optical function it carries. Previous studies on the surface generation mechanism in single-point diamond turning (SPDT) of Cu were limited to experimental analysis, while there is a lack of fundamental understanding of the fan-shaped pattern generation mechanism and suppression method. In the present study, the different fan-shaped patterns, surface quality, cutting force and chip morphology of the typical crystal planes (100), (110) and (111) planes of Cu were studied by both theoretical and experimental analyses. A molecular dynamics (MD) simulation was conducted to present the fundamental generation mechanism of the fan-shaped patterns from atom arrangement directions and its angle change with the main cutting direction, while a cutting dynamics model was established to simulate the generation of fan-shaped patterns on the machined surface. Based on theoretical and experimental analysis, it was found that the atom density arrangement directions of Cu and its angle change with the main cutting direction of SPDT caused fluctuations in the friction coefficient, which further caused the vibration of the cutting system and generated the fan-shaped patterns. The SPDT of crystal planes (100) can achieve the best surface quality. The present research provides a fundamental understanding of fan-shaped pattern formation on the machined surface, and provides an instruction for machining Cu to obtain better surface quality.

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Atomic Simulations of Deformation Mechanism of 3C-SiC Polishing Process with a Rolling Abrasive

Yin

Zhu

et al. 2021

Tribol Lett

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In the present study, molecular dynamics (MD) simulations are applied to investigate the polishing process of cubic silicon carbide (3C-SiC) with a rotating abrasive. The influence of abrasive rotational speed and rotation axis orientation on the friction characteristics and deformation behaviors of 3C-SiC is studied. The results show that as the rotational speed increases, the normal force first increases until it reaches its maximum at 25 rad/ns and then decreases. The evolution of transverse force with the rotational speed is more complicated and the smallest transverse force and friction coefficient are obtained at the rotational speed of 50 rad/ns. Besides, the transverse force increases while the normal force decreases with the rotation angle when the angular velocity vector of the rotational abrasive is parallel to the substrate surface. The case when the rotational speed is 25 rad/ns and the rotation angle is 0 is a significant critical situation. At the critical situation, we observe the lowest material removal rate, the deepest subsurface damage layer, the biggest high stress region and the smallest high temperature region for all rotational speeds and rotation axis orientations. Moreover, in the simulations, phase transformation (mainly amorphization) induced by high pressure is more pronounced than that by thermal effect. The results gained can shed light on the atomic-scale material removal and deformation mechanisms of 3C-SiC during polishing process.

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Depth-sensing ductile and brittle deformation in 3C-SiC under Berkovich nanoindentation

Cited by 34 publications

References 42 publications

Finite Element Modeling of Brittle and Ductile Modes in Cutting of 3C-SiC

Finite Element Modeling of Brittle and Ductile Modes in Cutting of 3C-SiC

Generation Mechanism and Dual Dynamic Simulations of Surface Patterns in Single-Point Diamond Turning of Single-Crystal Copper

Atomic Simulations of Deformation Mechanism of 3C-SiC Polishing Process with a Rolling Abrasive

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