2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems 2010
DOI: 10.1109/itherm.2010.5501375
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Design and analysis of high-performance air-cooled heat exchanger with an integrated capillary-pumped loop heat pipe

Abstract: We report the design and analysis of a high-power air-cooled heat exchanger capable of dissipating over 1000 W with 33 W of input electrical power and an overall thermal resistance of less than 0.05 K/W. The novelty of the design combines the blower and heat sink into an integrated compact unit (4" x 4" x 4") to maximize the heat transfer area and reduce the required airflow rates and power. The device consists of multiple impeller blades interdigitated with parallel-plate condensers of a capillary-pumped loop… Show more

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Cited by 10 publications
(8 citation statements)
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“…Such surfaces may therefore enable (1) substantial reduction in industrial con- denser sizes and cost [51]; (2) overall performance enhancement of devices such as heat pipes and thermal ground planes for applications requiring maximization of evaporator area and minimization of condenser area [56]; and (3) use of cooling devices previously not possible for local high heat flux electronic devices [18,57].…”
Section: Flat Versus Structured Surfacesmentioning
confidence: 99%
“…Such surfaces may therefore enable (1) substantial reduction in industrial con- denser sizes and cost [51]; (2) overall performance enhancement of devices such as heat pipes and thermal ground planes for applications requiring maximization of evaporator area and minimization of condenser area [56]; and (3) use of cooling devices previously not possible for local high heat flux electronic devices [18,57].…”
Section: Flat Versus Structured Surfacesmentioning
confidence: 99%
“…These fixed geometries were chosen as optimal solutions from a 3D finite element simulation using ANSYS FLUENT [4,19], while taking into consideration realistic manufacturing and size constraints. These numerical results showed that the dominant parameters affecting performance of the layer were the channel and blade thicknesses.…”
Section: Testingmentioning
confidence: 99%
“…This device (Fig. 1) is 10 cm  10 cm  10 cm and is targeted to consume less than 33 W of electrical power while dissipating over 1000 W of heat with a thermal resistance of less than 0.05 K/W [4].…”
Section: Introductionmentioning
confidence: 99%
“…In the liquid reservoir, a high permeability (1.6*10 -12 m 2 ) copper wick forms a bridge that enables heat transfer from the Monel wick to the top surface of the evaporator body, which is convectively cooled by airflow. [3] The geometry of the multi-layer wicking structure was designed using COMSOL Multiphysics, for a heat input of 1000 W, a convective boundary condition at the top surface (h=136.5 W/m 2 K), and a temperature difference between the base and ambient air of 50 °C. The Monel evaporator frame was modeled with a footprint of 10 cm x 10 cm and wall thicknesses of 2 mm and 1mm, for the sidewalls and top surface, respectively.…”
Section: Evaporatormentioning
confidence: 99%
“…A low-profile, permanent-magnet synchronous motor is mounted at the top of the stack to drive the impeller array. The target design consists of fifteen condensers to remove 1000 W with a 50 °C temperature difference between the evaporator base and the inlet air while keeping the electrical fan power to 33 W. Through the use of the LHP for near-isothermal finning and a narrow-clearance impeller array, a COP of 30 is expected [3].…”
Section: Introductionmentioning
confidence: 99%