2004
DOI: 10.1109/jlt.2004.829230
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Design and Analysis of Separate-Absorption-Transport-Charge-Multiplication Traveling-Wave Avalanche Photodetectors

Abstract: This paper proposes a novel type of avalanche photodiode-the separate-absorption-transport-charge-multiplication (SATCM) avalanche photodiode (APD). The novel design of photoabsorption and multiplication layers of APDs can avoid the photoabsorption layer breakdown and hole-transport problems, exhibit low operation voltage, and achieve ultra-high-gain bandwidth product performances. To achieve low excess noise and ultra-high-speed performance in the fiber communication regime (1.3 1.55 m), the simulated APD is … Show more

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Cited by 13 publications
(5 citation statements)
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“…This absorption layer thickness and the ratio of p-type/intrinsic layer thickness were chosen to balance the resistance-capacitance (RC) and transit time limited bandwidth [1]. We conducted an APD bandwidth simulation based on our proposed linear model, which included the bandwidth limiting factors of the avalanche delay time, secondary hole transit time, and RC-delay time [18]. For sensitivity measurement, samples of device C with both the top-and back-side illuminated structures were fabricated.…”
Section: (B)mentioning
confidence: 99%
“…This absorption layer thickness and the ratio of p-type/intrinsic layer thickness were chosen to balance the resistance-capacitance (RC) and transit time limited bandwidth [1]. We conducted an APD bandwidth simulation based on our proposed linear model, which included the bandwidth limiting factors of the avalanche delay time, secondary hole transit time, and RC-delay time [18]. For sensitivity measurement, samples of device C with both the top-and back-side illuminated structures were fabricated.…”
Section: (B)mentioning
confidence: 99%
“…Figure 10(a) and 10(b) shows the conceptual band diagram and top-view of fabricated device, respectively. We adopted the structure of traveling-wave photodiode [21] to realize our device for high bandwidth-efficiency product performance. As shown in Figure 10(b), the ridge optical waveguide structure can also minimize the long-tail problem, which is originated from the substrate photocurrent [1,[6][7][8], due to the confinement of optical power in the surface epi-layers.…”
Section: Sige/si Based Avalanche Photodiodementioning
confidence: 99%
“…The p-type doped profile and thin thickness of the barrier and well (33Å) of the Si 0.5 Ge 0.5 /Si SL can minimize the hole-trapping problem in traditional Si/SiGe multiple quantum well (MQW). We adopted such p-doped SL and a depleted Si layer to construct our photo-absorption region, which is similar to the structure of a p-i-n photodiode with partially p-doped photo-absorption region for high saturation power performance [2,21]. On the other hand, the trade-off between carrier multiplication time and RC bandwidth limitation, which is originated from the large device capacitance of a thin multiplication layer (150nm) and the carrier multiplication time, can be released due to the existence of this additional depleted Si layer [21].…”
Section: Sige/si Based Avalanche Photodiodementioning
confidence: 99%
“…Figures 1͑a͒ and 1͑b͒ show the conceptual band diagram and top view of the fabricated device, respectively. We adopted the structure of a traveling-wave photodiode 11 to realize our device for high bandwidth-efficiency product performance. As shown in Fig.…”
mentioning
confidence: 99%
“…12,13 We, thus, adopted p-doped SL and a depleted Si layer to construct our photoabsorption region, which is similar to the structure of a p-i-n photodiode with a partially p-doped photoabsorption region, 14 for the purpose of achieving high saturation power 14 and releasing the RC bandwidth limitation due to the thin multiplication layer ͑150 nm͒ in our structure. 11 The epitaxial layer structures were grown through ultrahigh vacuum/chemical vapor deposition ͑UHV/CVD͒ on an n + -doped Si substrate. We fabricated the demonstrated device by using the standard photolithography, metallization, liftoff, and dry etching processes.…”
mentioning
confidence: 99%