Design and analysis of wafer-level vacuum-encapsulated disk resonator gyroscope using a commercial MEMS process

Uppalapati, Balaadithya; Ahamed, Mohammed Jalal; Chodavarapu, Vamsy P.

doi:10.1109/naecon.2017.8268754

Cited by 4 publications

(2 citation statements)

References 43 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…WLVP can be realized mainly on the basis of polyimide bonding [20], fusion bonding [21], eutectic bonding [22], metal diffusion bonding [23], and anodic bonding [24]. WLVP is used in some kinds of microsensors, such as pressure sensors, accelerometers, and gyroscopes [25][26][27][28]. For example, Mahmood [27] proposed a wafer-level vacuum-packaged accelerometer based on polyimide bonding, but the usage of polyimide causes charge accumulation, leading to the deviation of results if the design is used for measuring an electric field.…”

Section: Introductionmentioning

confidence: 99%

Wafer-Level Vacuum-Packaged Electric Field Microsensor: Structure Design, Theoretical Model, Microfabrication, and Characterization

Xia

Peng

et al. 2022

Micromachines

View full text Add to dashboard Cite

This paper proposes a novel wafer-level vacuum packaged electric field microsensor (EFM) featuring a high quality factor, low driving voltage, low noise, and low power consumption. The silicon-on-insulator (SOI) conductive handle layer was innovatively used as the sensing channel to transmit the external electric field to the surface of the sensitive structure, and the vacuum packaging was realized through anodic bonding between the SOI and glass-on-silicon (GOS). The fabrication process was designed and successfully realized, featured with a simplified process and highly efficient batch manufacturing, and the final chip size was only 5 × 5 mm. A theoretical model for the packaged device was set up. The influence of key parameters in the packaging structure on the output characteristics of the microsensor was analyzed on the basis of the proposed model. Experiments were conducted on the wafer-level vacuum-packaged EFM to characterize its performance. Experimental results show that, under the condition of applying 5 V DC driving voltage, the required AC driving voltage of the sensor was only 0.05 VP, and the feedthrough was only 4.2 mV. The quality factor was higher than 5000 and was maintained with no drop in the 50-day test. The vacuum in the chamber of the sensor was about 10 Pa. A sensitivity of 0.16 mV/(kV/m) was achieved within the electrostatic field range of 0–50 kV/m. The linearity of the microsensor was 1.62%, and the uncertainty was 4.42%.

show abstract

Section: Introductionmentioning

confidence: 99%

Wafer-Level Vacuum-Packaged Electric Field Microsensor: Structure Design, Theoretical Model, Microfabrication, and Characterization

Xia

Peng

et al. 2022

Micromachines

View full text Add to dashboard Cite

show abstract

“…As a new generation gyroscope, the micro-electro-mechanical system disk resonator gyroscope (MEMS DRG) is an attractive candidate for high-performance MEMS gyroscopes due to its near navigational grade precision and small volume [ 1 , 2 , 3 , 4 , 5 ]. As a solid wave gyroscope (SWG), MEMS DRG inherently possesses a high Q factor and mode match mechanism, which maintain its low mechanical-thermal noise and high mechanical sensitivity [ 6 , 7 , 8 , 9 ].…”

Section: Introductionmentioning

confidence: 99%

Study of the Influence of Phase Noise on the MEMS Disk Resonator Gyroscope Interface Circuit

Zhang

Chen

Yin

et al. 2020

Sensors

View full text Add to dashboard Cite

In this paper, a detailed analysis of the influence of phase noise on the micro-electro-mechanical system (MEMS) disk resonator gyroscope (DRG) is presented. Firstly, a new time-varying phase noise model for the gyroscope is established, which explains how the drive loop circuit noise converts into phase noise. Different from previous works, the time-varying phase noise model in this paper is established in mechanical domain, which gain more physical insight into the origin of the phase noise in gyroscope. Furthermore, the impact of phase noise on DRG is derived, which shows how the phase noise affects angular velocity measurement. The analysis shows that, in MEMS DRG, the phase noise, together with other non-ideal factors such as direct excitation of secondary resonator, may cause a low frequency noise in the output of the gyroscope system and affect the bias stability of the gyroscope. Finally, numerical simulations and experiment tests are designed to prove the theories above.

show abstract

Toward Atmospheric Electricity Research: A Low-Cost, Highly Sensitive and Robust Balloon-Borne Electric Field Sounding Sensor

Yang

Chu

et al. 2021

IEEE Sensors J.

View full text Add to dashboard Cite

Design and analysis of wafer-level vacuum-encapsulated disk resonator gyroscope using a commercial MEMS process

Cited by 4 publications

References 43 publications

Wafer-Level Vacuum-Packaged Electric Field Microsensor: Structure Design, Theoretical Model, Microfabrication, and Characterization

Wafer-Level Vacuum-Packaged Electric Field Microsensor: Structure Design, Theoretical Model, Microfabrication, and Characterization

Study of the Influence of Phase Noise on the MEMS Disk Resonator Gyroscope Interface Circuit

Toward Atmospheric Electricity Research: A Low-Cost, Highly Sensitive and Robust Balloon-Borne Electric Field Sounding Sensor

Contact Info

Product

Resources

About