Design and development of thermal-mechanical solutions for a community personal computer

Abstract

This paper describes the thermal-mechanical solutions for a community personal computer (PC), which is developed for rural Indian communities where the harsh living environment always poses the reliability challenge to maintain a conventional personal computer. The thermal-mechanical solution for micro-Flip Chip Ball Grid Array (FCBGA) packaged CPU is presented and followed by the system level thermal, acoustic, dust-sandinsect protected solutions at 45℃ external ambient and dusty-sandy environment. To achieve better system acoustic performance, the system fan speed control (FSC) scheme is developed. Additionally, a dust-sand-insect filter is developed for the system which can protect dust, sand or insect no smaller than 1mm from the inside chassis. The thermal simulation and structural analysis results agree well with the corresponding validation data. Also, the acoustic measurement data indicates the system acoustic targets can be met with the FSC scheme.

The effect of surface modification on adhesion of polymer waveguide on flexible substrate

“…The loading continued until a reduced and stabilised in load signified the propagation of the crack. The crack length was measured using dye-and-pry technique [15]. By knowing the crack length a and the maximum load P, the adhesive strength of the interface can be quantified as strain energy release rate, G c [14]:…”