Design and fabrication of a transparent, tough and UVC screening material as a substitute for glass substrate in display devices

Shankar, Uday; Oberoi, Deepa; Avasarala, Srikanth; Ali, Shahajad; Bandyopadhyay, Anasuya

doi:10.1007/s10853-018-03285-8

Cited by 21 publications

(7 citation statements)

References 61 publications

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“…Composites materials are essential in many forms for the survival of human life, and they may be structural, [1][2][3][4] functional, [5,6] or biomaterial. [7] However, the fabrication of synthetic fibers for polymer composite manufacturing leads to the generation of immense waste and energy consumption.…”

Section: Introductionmentioning

confidence: 99%

Study of mechanical and thermal behavior of alkali modified groundnut shell powder reinforced ABS composites

Kumar

Singh

Kumari³

et al. 2022

Polymer Composites

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Current study employs reinforcement of untreated (GSP) and alkali treated groundnut shell powder (T-GSP) to the thermoplastic acrylonitrile-butadienestyrene (ABS) matrix for the fabrication of composites. Interactions of alkali to the cellulose, hemicellulose, and lignin of T-GSP was confirmed from the ATR-IR analysis. The most significant tensile strength (54.78 MPa) and modulus (2.78 GPa) was reported for 20 wt% T-GSP reinforced ABS composite. Additionally, greatest flexural strength and modulus of 88.30 MPa and 7.80 GPa was recorded for the composite constitutes 20 wt% T-GSP and 80 wt% ABS.The highest and lowest notched impact strength of 15.85 kJ/m 2 and 13.52 kJ/ m 2 were reported for the composites consist of 10 and 20 wt% of T-GSP. Composite 20/80 T-GSP/ABS exhibited highest shore D hardness value of 90. Morphology was studied using FE-SEM characterization and reports excellent wetting of T-GSP particles from ABS. Composites reinforced with 10 wt% of T-GSP exhibited highest (~269 C) while one reinforced with 20 wt% of the T-GSP showed lowest thermal degradation point (~259 C) throughout the temperature range. Differential scanning calorimetry (DSC) and dynamic mechanical analysis (DMA) analysis shows an increment (1-6 C) in the glass transition temperature of all the composites compared to pristine ABS irrespective of treatment.alkali-treatment, acrylonitrile-butadiene-styrene, groundnut shell powder, notched impact strength, thermoplastic composites | INTRODUCTIONComposites materials are essential in many forms for the survival of human life, and they may be structural, [1][2][3][4] functional, [5,6] or biomaterial. [7] However, the fabrication of synthetic fibers for polymer composite manufacturing leads to the generation of immense waste and energy consumption. Natural and sustainable reinforcement with high-mechanical strength could be the perfect and technoeconomic answer to these synthetic counterparts. Due to their environment-friendly and moderately good mechanical properties, they create a huge opportunity to implement them in different engineering and commercial applications. [8,9] For instance, industrial fibers like flax, Piyush Kumar is the first author.

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Section: Introductionmentioning

confidence: 99%

Study of mechanical and thermal behavior of alkali modified groundnut shell powder reinforced ABS composites

Kumar

Singh

Kumari³

et al. 2022

Polymer Composites

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“…PMMA is a widely used polymeric material owing to its excellent transparency throughout the λ vis. 65–67 The first significant use of PMMA took place during the Second World War for aircraft windows, submarine periscopes, gun turrets for airplanes, and so forth. It is known as acrylic glass, although PMMA is technically not a type of glass.…”

Section: Glass Like Polymeric Substratementioning

confidence: 99%

“…It can even retain the color of any specific state for a long time after switching off the external electrical power. Typical ECD is a sandwich structure of seven different layers, arranged from outside to inside, for example, glass substrate/transparent conductor (TC)/ECM/ionic conductor (IC)/ECM/TC/glass substrate 65 . The literature study has revealed that advanced ECD is exceptionally encouraging for electronic and display components, but its complicated structure limits its wide application.…”

Section: Applications Of Alternative Flexible Transparent Electrodesmentioning

confidence: 99%

A review on the alternative of indium tin oxide coated glass substrate in flexible and bendable organic optoelectronic device

Shankar

Oberoi

Bandyopadhyay

2022

Polymers for Advanced Techs

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Flexible and optically transparent electrodes (TEs) are essential for most state-of-art organic optoelectronic devices (OOED). The demand for bendable electronic devices with aesthetic impact and multi-functionality has driven the rapid development of flexible TEs with improved optoelectrical and mechanical properties. However, conventional rigid TEs, that is, indium tin oxide (ITO) coated glass substrate (ITO/glass), cannot match smart devices' requirements in unique fields, like electrochromic devices, electronic skins, and wearable electronics, foldable displays, smart windows, and solar cells. To substitute extensively used ITO/glass electrodes has been endeavored because of the increasing price and inherently brittle ITO and glass substrate behavior. Emerging TEs based on the combination of the polymers substrate and conducting fillers like graphene, carbon nanotubes, metal nanowires, and transparent conducting oxides are bendable, lightweight, and inexpensive. They have shown substantial prospects to be used in the devices mentioned above. With each tiny development in these emerging TE's, such as outstanding optoelectrical and mechanical features in flexible electrodes, they become more suitable for practical applications in miscellaneous bendable devices. This review summarizes the comprehensive overview of the modern alternative flexible TEs and their implementation in bendable and stretchable devices.

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“…[ 3,5–19 ] Glass is currently one of the most widely used display substrates for TVs, smart phones, and tablet PCs. [ 20–23 ] Electrode materials for thin‐film μLEDs on a glass substrate need to be carefully optimized to improve RC delay, power efficiency, stability, and production cost. Cu is an attractive material for thin‐film μLED electrodes due to its remarkable conductivity (5.98 × 10 5 S cm –1 ), [ 24 ] high robustness, [ 25,26 ] and cheap price (≈6500 times cheaper than Au), [ 27 ] as proven by the industrial application of copper interconnects in a‐Si TFT‐LCD.…”

Section: Figurementioning

confidence: 99%

A Flash‐Induced Robust Cu Electrode on Glass Substrates and Its Application for Thin‐Film μLEDs

et al. 2021

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displays based on individual chip transfer have already been demonstrated in a 150 inch commercial TV on the Consumer Electronics Show (CES) 2020. However, due to the time-consuming and expensive process of multimillion individual chip transfer for UHD TV, chip-based μLED has limitation in the mass production of low-cost μLED displays. In contrast, thinfilm μLED based on mass transfer of more than 10 000 LED chips in one time has great potential to reduce the product price of μLED panels. [1-4] Although many innovative studies of thin-film μLED technologies have been performed, little effort has been devoted to the fundamental materials in μLED devices and their effect on performance, reliability, and adhesion control. Material issues with thin-film μLED are related to the epitaxial wafer, target substrate, electrode, transfer, and packaging. [3,5-19] Glass is currently one of the most widely used display substrates for TVs, smart phones, and tablet PCs. [20-23] Electrode materials for thin-film μLEDs on a glass substrate need to be carefully optimized to improve RC delay, power efficiency, stability, and production cost. Cu is an attractive material for thin-film μLED electrodes due to its remarkable conductivity (5.98 × 10 5 S cm-1), [24] high robustness, [25,26] and cheap price (≈6500 times cheaper than Au), [27] A robust Cu conductor on a glass substrate for thin-film μLEDs using the flash-induced chemical/physical interlocking between Cu and glass is reported. During millisecond light irradiation, CuO nanoparticles (NPs) on the display substrate are transformed into a conductive Cu film by reduction and sintering. At the same time, intensive heating at the boundary of CuO NPs and glass chemically induces the formation of an ultrathin Cu 2 O interlayer within the Cu/glass interface for strong adhesion. Cu nanointerlocking occurs by transient glass softening and interface fluctuation to increase the contact area. Owing to these flash-induced interfacial interactions, the flash-activated Cu electrode exhibits an adhesion energy of 10 J m −2 , which is five times higher than that of vacuum-deposited Cu. An AlGaInP thin-film vertical μLED (VLED) forms an electrical interconnection with the flash-induced Cu electrode via an ACF bonding process, resulting in a high optical power density of 41 mW mm −2. The Cu conductor enables reliable VLED operation regardless of harsh thermal stress and moisture infiltration under a high-temperature storage test, temperature humidity test, and thermal shock test. 50 × 50 VLED arrays transferred onto the flash-induced robust Cu electrode show high illumination yield and uniform distribution of forward voltage, peak wavelength, and device temperature.

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Design and fabrication of a transparent, tough and UVC screening material as a substitute for glass substrate in display devices

Cited by 21 publications

References 61 publications

Study of mechanical and thermal behavior of alkali modified groundnut shell powder reinforced ABS composites

Study of mechanical and thermal behavior of alkali modified groundnut shell powder reinforced ABS composites

A review on the alternative of indium tin oxide coated glass substrate in flexible and bendable organic optoelectronic device

A Flash‐Induced Robust Cu Electrode on Glass Substrates and Its Application for Thin‐Film μLEDs

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