Design and fabrication of AlGaInP-based micro-light-emitting-diode array devices

Xingzhen, Bao; Liang, Jingqiu; Liang, Zhongzhu; Wang, Weibiao; Tian, Chao; Qin, Yuxin; Lü, Jin-guang

doi:10.1016/j.optlastec.2015.09.016

Cited by 12 publications

(7 citation statements)

References 25 publications

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“…There are possible solutions to electrically isolate the rows of the display: i) bonding red LEDs on a nonconductive substrate, ii) making the GaAs substrate semi-insulating, iii) or etching down to the backside of the GaAs substrate. Many research groups have implemented the red passive-matrix display in a variety of methods [7,18]. It shows the possibility to realize the full color display.…”

Section: Resultsmentioning

confidence: 99%

“…Although inorganic LEDs have many advantages, it is still challenging to realize a redgreen-blue (RGB) color controllable light source from one chip for a high-resolution micro-LEDs display. Many studies on micro-LEDs for application to optical communication or displays have been reported, but the developed LEDs have been limited to one color light source [5][6][7][8][9][10][11]. An epitaxially grown inorganic LED structure only has monochromatic light emission and requires that the fabricated red, green, and blue chips be separately arranged for full color emission.…”

Section: Introductionmentioning

confidence: 99%

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Fabrication of a vertically-stacked passive-matrix micro-LED array structure for a dual color display

et al. 2017

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We report a color tunable display consisting of two passive-matrix micro-LED array chips. The device has combined vertically stacked blue and green passive-matrix LED array chips sandwiched by a transparent bonding material. We demonstrate that vertically stacked blue and green micro-pixels are independently controllable with operation of four color modes. Moreover, the color of each pixel is tunable in the entire wavelength from the blue to green region (450 nm - 540 nm) by applying pulse-width-modulation bias voltage. This study is meaningful in that a dual color micro-LED array with a vertically stacked subpixel structure is realized.

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Section: Resultsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Fabrication of a vertically-stacked passive-matrix micro-LED array structure for a dual color display

et al. 2017

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“…The dimensions of micro-LEDs were 80 × 80 µm 2 . The AlGaInP based red FC micro-LED structure consisted of a metal layer, a GaInP etching stop layer, an n + -GaAs contact layer, n-cladding AlGaInP, an n-type AlInP diffusion barrier, GaInP/AlGaInP multiple quantum wells, a p-type AlInP diffusion barrier, p-cladding AlGaInP, and a p-GaP window layer [31,32]. The sapphire substrate was bonded onto the AlGaInP based red TFFC micro-LED to form the AlGaInP based red FC micro-LED [33].…”

Section: Simulation Modelmentioning

confidence: 99%

Light Extraction Analysis of AlGaInP Based Red and GaN Based Blue/Green Flip-Chip Micro-LEDs Using the Monte Carlo Ray Tracing Method

et al. 2019

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Micro-scale light emitting diodes (micro-LEDs) commonly employ a thin-film flip-chip (TFFC) structure whose substrate is lifted off by an excimer laser. However, flip-chip (FC) micro-LEDs with a substrate can provide a sharp rise on sidewall emission by increasing the sidewall area. Here, we investigate the influence of substrate thickness, encapsulation, surface texture, microstructures between the substrate and epilayer, as well as the size, cutting shape, and angle of the chip on the light extraction efficiencies (LEEs) of FC micro-LEDs by using the Monte Carlo ray tracing method. We find that the LEE of the blue FC micro-LED chip increases by 46.5% over that of the blue TFFC micro-LED chip. After the encapsulation with the epoxy lens is applied, the LEEs of the blue TFFC micro-LED and blue FC micro-LED increase by 129% and 110.5%, respectively. The underlying mechanisms for the use of surface texture, patterned sapphire substrate, air-void array, and chip shaping technologies to improve the LEEs of FC micro-LEDs are also investigated in detail. We find that the LEEs AlGaInP based red FC micro-LED and GaN based blue/green FC micro-LEDs exhibit a sharp rise when the chip size drops from 30 to 10 µm. The inverted trapezoid FC micro-LED with patterned sapphire substrate (PSS) and encapsulation shows extraordinarily strong top emission and high collimation. We believe that our study offers a promising and practical route for obtaining high efficiency micro-LEDs.

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“…After thinning the GaAs substrate, n-electrode was deposited and formed. Figure 1(d) shows a completed 5×5 LED array [12][13]. Figure 2 shows the schematic diagram of the test system.…”

Section: Materials and Fabricationmentioning

confidence: 99%

“…Heat dissipation can also be improved by reducing the substrate thickness or mounting the chip substrate with high thermal conductivity [11]. Recently, we reported a new fabrication method based on the Micro-Opto-Electro-Mechanical Systems (MOEMS) integrated technique that was used to efficiently fabricate micro LED arrays [12][13]. However, a detailed study of the thermal characteristics of the LED array fabricated by this method has not been performed.…”

Section: Introductionmentioning

confidence: 99%

Thermal Analysis and Design of AlGaInP-based Light Emitting Diode Arrays

Ban¹,

Liang²,

Liang³

et al. 2017

Current Optics and Photonics

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LED arrays with pixel numbers of 3×3, 4×4, and 5×5 have been studied in this paper in order to enhance the optical output power and decrease heat dissipation of an AlGaInP-based light emitting diode display device (pixel size of 280×280 µm) fabricated by micro-opto-electro-mechanical systems. Simulation results showed that the thermal resistances of the 3×3, 4×4, 5×5 arrays were 52°C/W, 69.7°C/W, and 84.3°C/W. The junction temperature was calculated by the peak wavelength shift method, which showed that the maximum value appears at the center pixel due to thermal crosstalk from neighboring pixels. The central temperature would be minimized with 40 µm pixel pitch and 150 µm substrate thickness as calculated by thermal modeling using finite element analysis. The modeling can be used to optimize parameters of highly integrated AlGaInP-based LED arrays fabricated by micro-opto-electro-mechanical systems technology.

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Design and fabrication of AlGaInP-based micro-light-emitting-diode array devices

Cited by 12 publications

References 25 publications

Fabrication of a vertically-stacked passive-matrix micro-LED array structure for a dual color display

Fabrication of a vertically-stacked passive-matrix micro-LED array structure for a dual color display

Light Extraction Analysis of AlGaInP Based Red and GaN Based Blue/Green Flip-Chip Micro-LEDs Using the Monte Carlo Ray Tracing Method

Thermal Analysis and Design of AlGaInP-based Light Emitting Diode Arrays

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